Issued Patents All Time
Showing 25 most recent of 57 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12131952 | Wafer dicing using femtosecond-based laser and plasma etch | Wei-Sheng Lei, Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar | 2024-10-29 |
| 11621194 | Wafer dicing using femtosecond-based laser and plasma etch | Wei-Sheng Lei, Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar | 2023-04-04 |
| 11195756 | Proximity contact cover ring for plasma dicing | Alexander Lerner, Ajay Kumar, Aparna Iyer, Alan Ouye | 2021-12-07 |
| 10910271 | Wafer dicing using femtosecond-based laser and plasma etch | Wei-Sheng Lei, Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar | 2021-02-02 |
| 10714390 | Wafer dicing using femtosecond-based laser and plasma etch | Wei-Sheng Lei, Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar | 2020-07-14 |
| 10692765 | Transfer arm for film frame substrate handling during plasma singulation of wafers | Alexander Lerner, Ajay Kumar, Brad Eaton, Aparna Iyer | 2020-06-23 |
| 10566238 | Wafer dicing using femtosecond-based laser and plasma etch | Wei-Sheng Lei, Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar | 2020-02-18 |
| 10217650 | Methods and apparatus for substrate edge cleaning | Song-Moon Suh, Todd Egan, Kalyanjit Ghosh, Leon Volfovski, Michael R. Rice +1 more | 2019-02-26 |
| 10163713 | Wafer dicing using femtosecond-based laser and plasma etch | Wei-Sheng Lei, Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar | 2018-12-25 |
| 10112259 | Damage isolation by shaped beam delivery in laser scribing process | Nir Merry, Todd Egan | 2018-10-30 |
| 9443714 | Methods and apparatus for substrate edge cleaning | Song-Moon Suh, Todd Egan, Kalyanjit Ghosh, Leon Volfovski, Michael R. Rice +1 more | 2016-09-13 |
| 9299614 | Method and carrier for dicing a wafer | Brad Eaton, Aparna Iyer, Ajay Kumar | 2016-03-29 |
| 9245802 | Wafer dicing using femtosecond-based laser and plasma etch | Wei-Sheng Lei, Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar | 2016-01-26 |
| 9218992 | Hybrid laser and plasma etch wafer dicing using substrate carrier | Saravjeet Singh, Brad Eaton, Ajay Kumar, Wei-Sheng Lei, Madhava Rao Yalamanchili +1 more | 2015-12-22 |
| 9177782 | Methods and apparatus for cleaning a substrate | Song-Moon Suh, Shalina Sudheeran, Glen T. Mori | 2015-11-03 |
| 9130056 | Bi-layer wafer-level underfill mask for wafer dicing and approaches for performing wafer dicing | James S. Papanu, Wei-Sheng Lei, Brad Eaton, Ajay Kumar | 2015-09-08 |
| 9054176 | Multi-step and asymmetrically shaped laser beam scribing | Wei-Sheng Lei, Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar | 2015-06-09 |
| 9029242 | Damage isolation by shaped beam delivery in laser scribing process | Nir Merry, Todd Egan | 2015-05-12 |
| 8999816 | Pre-patterned dry laminate mask for wafer dicing processes | Aparna Iyer, Brad Eaton, Ajay Kumar | 2015-04-07 |
| 8912077 | Hybrid laser and plasma etch wafer dicing using substrate carrier | Saravjeet Singh, Brad Eaton, Ajay Kumar, Wei-Sheng Lei, Madhava Rao Yalamanchili +1 more | 2014-12-16 |
| 8883615 | Approaches for cleaning a wafer during hybrid laser scribing and plasma etching wafer dicing processes | Wei-Sheng Lei, James S. Papanu, Ajay Kumar | 2014-11-11 |
| 8874768 | Methods for providing security over untrusted networks | Stephen E. Levin, James O Nickel, Edwin H. Wrench, Jr. | 2014-10-28 |
| 8853056 | Wafer dicing using femtosecond-based laser and plasma etch | Wei-Sheng Lei, Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar | 2014-10-07 |
| 8759197 | Multi-step and asymmetrically shaped laser beam scribing | — | 2014-06-24 |
| 8642448 | Wafer dicing using femtosecond-based laser and plasma etch | Wei-Sheng Lei, Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar | 2014-02-04 |