Issued Patents All Time
Showing 26–39 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8951819 | Wafer dicing using hybrid split-beam laser scribing process with plasma etch | Wei-Sheng Lei, Brad Eaton, Saravjeet Singh, Ajay Kumar, Aparna Iyer | 2015-02-10 |
| 8946057 | Laser and plasma etch wafer dicing using UV-curable adhesive film | Wei-Sheng Lei, Mohammad Kamruzzaman Chowdhury, Todd Egan, Brad Eaton, Ajay Kumar | 2015-02-03 |
| 8912077 | Hybrid laser and plasma etch wafer dicing using substrate carrier | Saravjeet Singh, Brad Eaton, Ajay Kumar, Wei-Sheng Lei, James M. Holden +1 more | 2014-12-16 |
| 8883614 | Wafer dicing with wide kerf by laser scribing and plasma etching hybrid approach | Wei-Sheng Lei, Brad Eaton, Apama Iyer, Ajay Kumar | 2014-11-11 |
| 8859397 | Method of coating water soluble mask for laser scribing and plasma etch | Wei-Sheng Lei, Brad Eaton, Aparna Iyer, Todd Egan, Ajay Kumar | 2014-10-14 |
| 8853056 | Wafer dicing using femtosecond-based laser and plasma etch | Wei-Sheng Lei, Brad Eaton, Saravjeet Singh, Ajay Kumar, James M. Holden | 2014-10-07 |
| 8845854 | Laser, plasma etch, and backside grind process for wafer dicing | Wei-Sheng Lei, Brad Eaton, Saravjeet Singh, Ajay Kumar | 2014-09-30 |
| 8846498 | Wafer dicing using hybrid multi-step laser scribing process with plasma etch | Wei-Sheng Lei, Brad Eaton, Saravjeet Singh, Ajay Kumar | 2014-09-30 |
| 8703581 | Water soluble mask for substrate dicing by laser and plasma etch | Wei-Sheng Lei, Saravjeet Singh, Brad Eaton, Ajay Kumar | 2014-04-22 |
| 8652940 | Wafer dicing used hybrid multi-step laser scribing process with plasma etch | Wei-Sheng Lei, Brad Eaton, Saravjeet Singh, Ajay Kumar | 2014-02-18 |
| 8642448 | Wafer dicing using femtosecond-based laser and plasma etch | Wei-Sheng Lei, Brad Eaton, Saravjeet Singh, Ajay Kumar, James M. Holden | 2014-02-04 |
| 8598016 | In-situ deposited mask layer for device singulation by laser scribing and plasma etch | Wei-Sheng Lei, Brad Eaton, Saravjeet Singh, Ajay Kumar, Banqiu Wu | 2013-12-03 |
| 8557683 | Multi-step and asymmetrically shaped laser beam scribing | Wei-Sheng Lei, Brad Eaton, Saravjeet Singh, Ajay Kumar, James M. Holden | 2013-10-15 |
| 8507363 | Laser and plasma etch wafer dicing using water-soluble die attach film | Wei-Sheng Lei, Brad Eaton, Saravjeet Singh, Ajay Kumar | 2013-08-13 |