Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8883614 | Wafer dicing with wide kerf by laser scribing and plasma etching hybrid approach | Wei-Sheng Lei, Brad Eaton, Madhava Rao Yalamanchili, Ajay Kumar | 2014-11-11 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8883614 | Wafer dicing with wide kerf by laser scribing and plasma etching hybrid approach | Wei-Sheng Lei, Brad Eaton, Madhava Rao Yalamanchili, Ajay Kumar | 2014-11-11 |