Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10903055 | Edge ring for bevel polymer reduction | Rohit Mishra, Graeme Scott, Sheshraj L. Yulshibagwale, Sriskantharajah Thirunavukarasu | 2021-01-26 |
| 9039908 | Post etch reactive plasma milling to smooth through substrate via sidewalls and other deeply etched features | Jon C. Farr, Sharma Pamarthy | 2015-05-26 |
| 9023227 | Increased deposition efficiency and higher chamber conductance with source power increase in an inductively coupled plasma (ICP) chamber | Jivko Dinev, Saravjeet Singh, Tong Liu, Puneet Bajaj, Rohit Mishra +3 more | 2015-05-05 |
| 8987140 | Methods for etching through-silicon vias with tunable profile angles | Puneet Bajaj, Tong Liu | 2015-03-24 |
| 8158522 | Method of forming a deep trench in a substrate | Digvijay A. Raorane, Jon C. Farr, Sharma Pamarthy | 2012-04-17 |