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Home › Post etch reactive plasma milling to smooth through substrate via sidewalls and other deeply etched features

Post etch reactive plasma milling to smooth through substrate via sidewalls and other deeply etched features

US Patent 9039908 · Granted May 26, 2015

Estimated economic value: $17,022,000 ⓘ

Assignee

Applied Materials

Inventors

Jon C. Farr (10 patents)
Sharma Pamarthy (9 patents)
Khalid Mohiuddin Sirajuddin (5 patents)

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