Issued Patents All Time
Showing 76–93 of 93 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8932939 | Water soluble mask formation by dry film lamination | Wei-Sheng Lei, James S. Papanu, Ajay Kumar | 2015-01-13 |
| 8927393 | Water soluble mask formation by dry film vacuum lamination for laser and plasma dicing | Wei-Sheng Lei, James S. Papanu, Prabhat Kumar, Ajay Kumar | 2015-01-06 |
| 8912078 | Dicing wafers having solder bumps on wafer backside | Wei-Sheng Lei, James S. Papanu, Aparna Iyer, Ajay Kumar | 2014-12-16 |
| 8912075 | Wafer edge warp supression for thin wafer supported by tape frame | Wei-Sheng Lei, Ajay Kumar | 2014-12-16 |
| 8912077 | Hybrid laser and plasma etch wafer dicing using substrate carrier | Saravjeet Singh, Ajay Kumar, Wei-Sheng Lei, James M. Holden, Madhava Rao Yalamanchili +1 more | 2014-12-16 |
| 8883614 | Wafer dicing with wide kerf by laser scribing and plasma etching hybrid approach | Wei-Sheng Lei, Apama Iyer, Madhava Rao Yalamanchili, Ajay Kumar | 2014-11-11 |
| 8859397 | Method of coating water soluble mask for laser scribing and plasma etch | Wei-Sheng Lei, Aparna Iyer, Todd Egan, Madhava Rao Yalamanchili, Ajay Kumar | 2014-10-14 |
| 8853056 | Wafer dicing using femtosecond-based laser and plasma etch | Wei-Sheng Lei, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar, James M. Holden | 2014-10-07 |
| 8845854 | Laser, plasma etch, and backside grind process for wafer dicing | Wei-Sheng Lei, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar | 2014-09-30 |
| 8846498 | Wafer dicing using hybrid multi-step laser scribing process with plasma etch | Wei-Sheng Lei, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar | 2014-09-30 |
| 8703581 | Water soluble mask for substrate dicing by laser and plasma etch | Wei-Sheng Lei, Saravjeet Singh, Madhava Rao Yalamanchili, Ajay Kumar | 2014-04-22 |
| 8652940 | Wafer dicing used hybrid multi-step laser scribing process with plasma etch | Wei-Sheng Lei, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar | 2014-02-18 |
| 8642448 | Wafer dicing using femtosecond-based laser and plasma etch | Wei-Sheng Lei, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar, James M. Holden | 2014-02-04 |
| 8598016 | In-situ deposited mask layer for device singulation by laser scribing and plasma etch | Madhava Rao Yalamanchili, Wei-Sheng Lei, Saravjeet Singh, Ajay Kumar, Banqiu Wu | 2013-12-03 |
| 8557683 | Multi-step and asymmetrically shaped laser beam scribing | Wei-Sheng Lei, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar, James M. Holden | 2013-10-15 |
| 8557682 | Multi-layer mask for substrate dicing by laser and plasma etch | James M. Holden, Wei-Sheng Lei, Todd Egan, Saravjeet Singh | 2013-10-15 |
| 8507363 | Laser and plasma etch wafer dicing using water-soluble die attach film | Wei-Sheng Lei, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar | 2013-08-13 |
| 5019071 | Adhesive fastening tab | Stephen W. Bany, John A. Miller | 1991-05-28 |