Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12344955 | Electroplating co-planarity improvement by die shielding | Paul R. McHugh, Gregory J. Wilson, John L. Klocke, Nolan L. Zimmerman | 2025-07-01 |
| 12146235 | Plating and deplating currents for material co-planarity in semiconductor plating processes | Paul R. McHugh, Jing Xu, John L. Klocke, Sam Lee, Keith E. Ypma | 2024-11-19 |
| 11697887 | Multi-compartment electrochemical replenishment cell | Nolan L. Zimmerman, Gregory J. Wilson, Paul R. McHugh, Paul Van Valkenburg, Deepak Saagar Kalaikadal +1 more | 2023-07-11 |
| 11686005 | Electroplating systems and methods with increased metal ion concentrations | Kwan Wook Roh, Kyle M. Hanson | 2023-06-27 |
| 10840104 | Controlled etch of nitride features | Eric J. Bergman, John L. Klocke, Kyle M. Hanson, Paul R. McHugh | 2020-11-17 |
| 9922874 | Methods of enhancing polymer adhesion to copper | Prayudi Lianto, Sam Lee, Marvin L. Bernt, Guan Huei See, Arvind Sundarrajan | 2018-03-20 |
| 9758893 | Electroplating methods for semiconductor substrates | Sam Lee | 2017-09-12 |