| 12408239 |
PBN heaters for ALD temperature uniformity |
Kenneth Brian Doering, Karthik Ramanathan, Mario D. Silvetti, Kevin Griffin |
2025-09-02 |
|
| 12344955 |
Electroplating co-planarity improvement by die shielding |
Charles Sharbono, Paul R. McHugh, John L. Klocke, Nolan L. Zimmerman |
2025-07-01 |
|
| 12288677 |
Vertically adjustable plasma source |
Tsutomu Tanaka, Jared Ahmad Lee, Rakesh Ramadas, Dmitry A. Dzilno, Sriharish Srinivasan |
2025-04-29 |
|
| 12116686 |
Parameter adjustment model for semiconductor processing chambers |
Eric J. Bergman, Adam Marc McClure, Paul R. McHugh, John L. Klocke |
2024-10-15 |
$93,354,000 |
| 12104269 |
Mechanically-driven oscillating flow agitation |
Paul R. McHugh |
2024-10-01 |
$68,865,000 |
| 12087571 |
Methods, systems, and apparatus for tape-frame substrate cleaning and drying |
Ying Wang, Guan Huei See |
2024-09-10 |
$81,152,000 |
| 11982008 |
Electroplating system |
Paul R. McHugh, Kyle M. Hanson, John L. Klocke, Paul Van Valkenburg, Eric J. Bergman +5 more |
2024-05-14 |
$61,768,000 |
| 11984358 |
Systems and methods for improving within die co-planarity uniformity |
Paul R. McHugh, Kwan Wook Roh |
2024-05-14 |
$61,768,000 |
| 11837464 |
Methods, systems, and apparatus for tape-frame substrate cleaning and drying |
Ying Wang, Guan Huei See |
2023-12-05 |
$45,995,000 |
| 11814744 |
Substrate cleaning components and methods in a plating system |
Nolan L. Zimmerman, Andrew Anten, Richard W. Plavidal, Eric J. Bergman, Tricia Youngbull +2 more |
2023-11-14 |
$33,075,000 |
| 11705312 |
Vertically adjustable plasma source |
Tsutomu Tanaka, Jared Ahmad Lee, Rakesh Ramadas, Dmitry A. Dzilno, Sriharish Srinivasan |
2023-07-18 |
$58,990,000 |
| 11697887 |
Multi-compartment electrochemical replenishment cell |
Nolan L. Zimmerman, Charles Sharbono, Paul R. McHugh, Paul Van Valkenburg, Deepak Saagar Kalaikadal +1 more |
2023-07-11 |
$39,838,000 |
| 11585009 |
Mechanically-driven oscillating flow agitation |
Paul R. McHugh |
2023-02-21 |
$24,540,000 |
| 11578422 |
Electroplating system |
Paul R. McHugh, Kyle M. Hanson, John L. Klocke, Paul Van Valkenburg, Eric J. Bergman +5 more |
2023-02-14 |
$35,617,000 |
| 11550224 |
Apparatus for post exposure bake |
Kyle M. Hanson, Viachslav Babayan |
2023-01-10 |
$38,290,000 |
| 11367653 |
Systems and methods for improving within die co-planarity uniformity |
Paul R. McHugh, Kwan Wook Roh |
2022-06-21 |
$42,836,000 |
| 11268208 |
Electroplating system |
Paul R. McHugh, Kyle M. Hanson, John L. Klocke, Paul Van Valkenburg, Eric J. Bergman +5 more |
2022-03-08 |
$69,139,000 |
| 11241718 |
Cleaning components and methods in a plating system |
Joseph Antony Jonathan, Kyle M. Hanson, Jason Rye, James Emery Brown, Eric J. Bergman +2 more |
2022-02-08 |
$81,917,000 |
| 11230793 |
Mechanically-driven oscillating flow agitation |
Paul R. McHugh |
2022-01-25 |
$92,631,000 |
| 10837119 |
Microelectronic substrate electro processing system |
Robert B. Moore, David Silvetti, Paul Z. Wirth, Randy Harris, Daniel J. Woodruff |
2020-11-17 |
$41,112,000 |
| 10754252 |
Apparatus for post exposure bake |
Kyle M. Hanson, Viachslav Babayan |
2020-08-25 |
$29,525,000 |
| 10655226 |
Apparatus and methods to improve ALD uniformity |
Paul R. McHugh, Karthik Ramanathan |
2020-05-19 |
$40,373,000 |
| 10577712 |
Electroplating apparatus with electrolyte agitation |
Paul R. McHugh |
2020-03-03 |
$21,905,000 |
| 10570526 |
Electroplating wafers having a pattern induced non-uniformity |
Paul R. McHugh |
2020-02-25 |
$22,337,000 |
| 10494731 |
Electroplating dynamic edge control |
Paul R. McHugh, Daniel J. Woodruff, Marvin L. Bernt |
2019-12-03 |
$22,017,000 |
