| 11935770 |
Modular mainframe layout for supporting multiple semiconductor process modules or chambers |
Coby Scott GROVE, Paul Z. Wirth, Avinash SHANTARAM, Alpay Yilmaz, Amir NISSAN +1 more |
2024-03-19 |
$54,086,000 |
| 11935771 |
Modular mainframe layout for supporting multiple semiconductor process modules or chambers |
Coby Scott GROVE, Paul Z. Wirth, Avinash SHANTARAM, Alpay Yilmaz, Amir NISSAN +3 more |
2024-03-19 |
$54,086,000 |
| 11899366 |
Method and apparatus for post exposure processing of photoresist wafers |
Viachslav Babayan, Douglas A. Buchberger, Jr., Qiwei Liang, Ludovic Godet, Srinivas D. Nemani +2 more |
2024-02-13 |
$47,589,000 |
| 11112697 |
Method and apparatus for post exposure processing of photoresist wafers |
Viachslav Babayan, Douglas A. Buchberger, Jr., Qiwei Liang, Ludovic Godet, Srinivas D. Nemani +2 more |
2021-09-07 |
$49,370,000 |
| 10837119 |
Microelectronic substrate electro processing system |
Robert B. Moore, David Silvetti, Paul Z. Wirth, Daniel J. Woodruff, Gregory J. Wilson |
2020-11-17 |
$41,112,000 |
| 10474033 |
Method and apparatus for post exposure processing of photoresist wafers |
Viachslav Babayan, Douglas A. Buchberger, Jr., Qiwei Liang, Ludovic Godet, Srinivas D. Nemani +2 more |
2019-11-12 |
$41,829,000 |
| 10372834 |
Creating and using an integrated technical data package |
Dan Z. Sokol, Robert A. Roush, Randy Strobel |
2019-08-06 |
|
| 10373864 |
Systems and methods for wetting substrates |
Paul R. McHugh, Bridger Earl HOERNER, Marvin L. Bernt, Thomas H. Oberlitner, Brian Aegerter +3 more |
2019-08-06 |
$24,698,000 |
| 10203604 |
Method and apparatus for post exposure processing of photoresist wafers |
Viachslav Babayan, Douglas A. Buchberger, Jr., Qiwei Liang, Ludovic Godet, Srinivas D. Nemani +2 more |
2019-02-12 |
$37,465,000 |
| 10174437 |
Wafer electroplating chuck assembly |
Michael Windham |
2019-01-08 |
$16,165,000 |
| 10087544 |
Microelectronic substrate electro processing system |
Robert B. Moore, David Silvetti, Paul Z. Wirth |
2018-10-02 |
$29,675,000 |
| 9812344 |
Wafer processing system with chuck assembly maintenance module |
Jason Rye, Mario David Silvetti, Bryan Puch, Vincent Steffan Francischetti, Satish Sundar |
2017-11-07 |
$31,945,000 |
| 9598788 |
Electroplating apparatus with contact ring deplating |
Bryan Puch |
2017-03-21 |
$25,880,000 |
| 9399827 |
Microelectronic substrate electro processing system |
Robert B. Moore, David Silvetti, Paul Z. Wirth |
2016-07-26 |
$40,439,000 |
| 8968533 |
Electroplating processor with geometric electrolyte flow path |
Daniel J. Woodruff, Jeffrey I. Turner, Gregory J. Wilson, Paul R. McHugh |
2015-03-03 |
$11,301,000 |
| 8900425 |
Contact ring for an electrochemical processor |
Paul R. McHugh, Gregory J. Wilson |
2014-12-02 |
$13,777,000 |
| 7934898 |
High throughput semiconductor wafer processing |
Steve Eudy, Paul Z. Wirth |
2011-05-03 |
|
| 7849865 |
System for processing a workpiece |
— |
2010-12-14 |
|
| 7520286 |
Apparatus and method for cleaning and drying a container for semiconductor workpieces |
Jeffry Davis |
2009-04-21 |
$2,336,000 |
| 7371306 |
Integrated tool with interchangeable wet processing components for processing microfeature workpieces |
Jeffry Davis |
2008-05-13 |
$1,243,000 |
| 7371998 |
Thermal wafer processor |
Gregory J. Wilson, Paul R. McHugh |
2008-05-13 |
$1,243,000 |
| 7334826 |
End-effectors for handling microelectronic wafers |
Daniel J. Woodruff, James J. Erickson, Douglas W. Carr |
2008-02-26 |
$2,741,000 |
| 7333223 |
System and method for electronically delivering documents |
Junious Gupton, Todd Beck, Varun Tandon, Glen C. Young, Jeff Gainer +1 more |
2008-02-19 |
$63,945,000 |
| 7281741 |
End-effectors for handling microelectronic workpieces |
Daniel J. Woodruff, Thomas H. Oberlitner, James J. Erickson, Douglas W. Carr |
2007-10-16 |
$2,748,000 |
| 7277195 |
System and method for monitoring information delivered through an electronic delivery system |
Scott M. Hamilton, Junious Gupton, Todd Beck, Varun Tandon, Glen C. Young +1 more |
2007-10-02 |
$59,816,000 |
