Issued Patents All Time
Showing 25 most recent of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11935770 | Modular mainframe layout for supporting multiple semiconductor process modules or chambers | Coby Scott GROVE, Paul Z. Wirth, Avinash SHANTARAM, Alpay Yilmaz, Amir NISSAN +1 more | 2024-03-19 |
| 11935771 | Modular mainframe layout for supporting multiple semiconductor process modules or chambers | Coby Scott GROVE, Paul Z. Wirth, Avinash SHANTARAM, Alpay Yilmaz, Amir NISSAN +3 more | 2024-03-19 |
| 11899366 | Method and apparatus for post exposure processing of photoresist wafers | Viachslav Babayan, Douglas A. Buchberger, Jr., Qiwei Liang, Ludovic Godet, Srinivas D. Nemani +2 more | 2024-02-13 |
| 11112697 | Method and apparatus for post exposure processing of photoresist wafers | Viachslav Babayan, Douglas A. Buchberger, Jr., Qiwei Liang, Ludovic Godet, Srinivas D. Nemani +2 more | 2021-09-07 |
| 10837119 | Microelectronic substrate electro processing system | Robert B. Moore, David Silvetti, Paul Z. Wirth, Daniel J. Woodruff, Gregory J. Wilson | 2020-11-17 |
| 10474033 | Method and apparatus for post exposure processing of photoresist wafers | Viachslav Babayan, Douglas A. Buchberger, Jr., Qiwei Liang, Ludovic Godet, Srinivas D. Nemani +2 more | 2019-11-12 |
| 10372834 | Creating and using an integrated technical data package | Dan Z. Sokol, Robert A. Roush, Randy Strobel | 2019-08-06 |
| 10373864 | Systems and methods for wetting substrates | Paul R. McHugh, Bridger Earl HOERNER, Marvin L. Bernt, Thomas H. Oberlitner, Brian Aegerter +3 more | 2019-08-06 |
| 10203604 | Method and apparatus for post exposure processing of photoresist wafers | Viachslav Babayan, Douglas A. Buchberger, Jr., Qiwei Liang, Ludovic Godet, Srinivas D. Nemani +2 more | 2019-02-12 |
| 10174437 | Wafer electroplating chuck assembly | Michael Windham | 2019-01-08 |
| 10087544 | Microelectronic substrate electro processing system | Robert B. Moore, David Silvetti, Paul Z. Wirth | 2018-10-02 |
| 9812344 | Wafer processing system with chuck assembly maintenance module | Jason Rye, Mario David Silvetti, Bryan Puch, Vincent Steffan Francischetti, Satish Sundar | 2017-11-07 |
| 9598788 | Electroplating apparatus with contact ring deplating | Bryan Puch | 2017-03-21 |
| 9399827 | Microelectronic substrate electro processing system | Robert B. Moore, David Silvetti, Paul Z. Wirth | 2016-07-26 |
| 8968533 | Electroplating processor with geometric electrolyte flow path | Daniel J. Woodruff, Jeffrey I. Turner, Gregory J. Wilson, Paul R. McHugh | 2015-03-03 |
| 8900425 | Contact ring for an electrochemical processor | Paul R. McHugh, Gregory J. Wilson | 2014-12-02 |
| 7934898 | High throughput semiconductor wafer processing | Steve Eudy, Paul Z. Wirth | 2011-05-03 |
| 7849865 | System for processing a workpiece | — | 2010-12-14 |
| 7520286 | Apparatus and method for cleaning and drying a container for semiconductor workpieces | Jeffry Davis | 2009-04-21 |
| 7371306 | Integrated tool with interchangeable wet processing components for processing microfeature workpieces | Jeffry Davis | 2008-05-13 |
| 7371998 | Thermal wafer processor | Gregory J. Wilson, Paul R. McHugh | 2008-05-13 |
| 7334826 | End-effectors for handling microelectronic wafers | Daniel J. Woodruff, James J. Erickson, Douglas W. Carr | 2008-02-26 |
| 7333223 | System and method for electronically delivering documents | Junious Gupton, Todd Beck, Varun Tandon, Glen C. Young, Jeff Gainer +1 more | 2008-02-19 |
| 7281741 | End-effectors for handling microelectronic workpieces | Daniel J. Woodruff, Thomas H. Oberlitner, James J. Erickson, Douglas W. Carr | 2007-10-16 |
| 7277195 | System and method for monitoring information delivered through an electronic delivery system | Scott M. Hamilton, Junious Gupton, Todd Beck, Varun Tandon, Glen C. Young +1 more | 2007-10-02 |