Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11984335 | FOUP or cassette storage for hybrid substrate bonding system | Ruiping Wang, Avinash SHANTARAM, Jitendra Ratilal BHIMJIYANI | 2024-05-14 |
| 11935770 | Modular mainframe layout for supporting multiple semiconductor process modules or chambers | Randy Harris, Paul Z. Wirth, Avinash SHANTARAM, Alpay Yilmaz, Amir NISSAN +1 more | 2024-03-19 |
| 11935771 | Modular mainframe layout for supporting multiple semiconductor process modules or chambers | Randy Harris, Paul Z. Wirth, Avinash SHANTARAM, Alpay Yilmaz, Amir NISSAN +3 more | 2024-03-19 |
| 6930046 | Single workpiece processing system | Kyle M. Hanson, Eric Lund, Steven L. Peace, Paul Z. Wirth, Scott Bruner +1 more | 2005-08-16 |
| 6030208 | Thermal processor | Victor J. Williams, Robert A. Weaver | 2000-02-29 |