Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
YW

Ying Wang — 20 Patents

Applied Materials: 9 patents #1,438 of 7,310Top 20%
Kla-Tencor: 3 patents #721 of 2,049Top 40%
Motorola: 3 patents #4,127 of 14,142Top 30%
UMUnited Microelectronics: 2 patents #1,942 of 4,560Top 45%
RSRealtek Semiconductor: 1 patents #915 of 1,741Top 55%
Overall (All Time): #214,803 of 4,157,543Top 6%
20 Patents All Time
Ying Wang has been granted 20 US patents while listed as an inventor at Applied Materials. The first was granted in 2002 and the most recent in September 2025. Ying Wang ranks #214,803 of 4,157,543 US inventors in our database (top 5.2%). Patent records list Ying Wang in Singapore, IL, SG.

Issued Patents All Time

Showing 1–20 of 20 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
12417998 Procedure to enable die rework for hybrid bonding Guan Huei See 2025-09-16
12405892 Electronic apparatus and command accessing method thereof having power saving mechanism Jui-Yuan Lin 2025-09-02
12374586 Methods of TSV formation for advanced packaging Peng Suo, Guan Huei See, Chang Bum Yong, Arvind Sundarrajan 2025-07-29
12237186 On-board cleaning of tooling parts in hybrid bonding tool Ruiping Wang, Guan Huei See, Ananthkrishna Jupudi, Praveen Kumar Choragudi 2025-02-25
12087571 Methods, systems, and apparatus for tape-frame substrate cleaning and drying Guan Huei See, Gregory J. Wilson 2024-09-10 $81,152,000
12001193 Apparatus for environmental control of dies and substrates for hybrid bonding Xundong Dai, Guan Huei See, Ruiping Wang, Michael R. Rice, Hari Ponnekanti +1 more 2024-06-04 $68,807,000
11854886 Methods of TSV formation for advanced packaging Peng Suo, Guan Huei See, Chang Bum Yong, Arvind Sundarrajan 2023-12-26 $30,871,000
11837464 Methods, systems, and apparatus for tape-frame substrate cleaning and drying Guan Huei See, Gregory J. Wilson 2023-12-05 $45,995,000
11756925 Methods and apparatus for vacuum processing a substrate Ruiping Wang 2023-09-12 $47,983,000
11404318 Methods of forming through-silicon vias in substrates for advanced packaging Peng Suo, Guan Huei See, Chang Bum Yong, Arvind Sundarrajan 2022-08-02 $46,822,000
8202440 Methods and apparatus for electron beam assisted etching at low temperatures Mehran Nasser-Ghodsi, Harrison H. Chin, Anne Testoni, R. Chris Burns 2012-06-19 $14,766,000
7902673 Semiconductor device 2011-03-08 $1,765,000
7875990 Wind-energy power machine and storage energy power generating system and wind-driven power generating system Qingwan Lin 2011-01-25
7777363 Wind engine and wind power system Qingwan Lin 2010-08-17
7723130 Tooling method for fabricating a semiconductor device and semiconductor devices fabricated thereof 2010-05-25 $3,346,000
6924484 Void characterization in metal interconnect structures using X-ray emission analyses Anne Testoni 2005-08-02 $63,200,000
6777676 Non-destructive root cause analysis on blocked contact or via Yeishin Tung, Anne Testoni 2004-08-17 $27,162,000
6763580 Method and apparatus for securing an electrically conductive interconnect through a metallic substrate Stanton Rak 2004-07-20 $15,770,000
6749105 Method and apparatus for securing a metallic substrate to a metallic housing Thomas P. Gall 2004-06-15 $41,733,000
6449158 Method and apparatus for securing an electronic power device to a heat spreader Clark D. Fischbach, Robert A. Richter 2002-09-10 $21,644,000