Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417998 | Procedure to enable die rework for hybrid bonding | Guan Huei See | 2025-09-16 |
| 12405892 | Electronic apparatus and command accessing method thereof having power saving mechanism | Jui-Yuan Lin | 2025-09-02 |
| 12374586 | Methods of TSV formation for advanced packaging | Peng Suo, Guan Huei See, Chang Bum Yong, Arvind Sundarrajan | 2025-07-29 |
| 12237186 | On-board cleaning of tooling parts in hybrid bonding tool | Ruiping Wang, Guan Huei See, Ananthkrishna Jupudi, Praveen Kumar Choragudi | 2025-02-25 |
| 12087571 | Methods, systems, and apparatus for tape-frame substrate cleaning and drying | Guan Huei See, Gregory J. Wilson | 2024-09-10 |
| 12001193 | Apparatus for environmental control of dies and substrates for hybrid bonding | Xundong Dai, Guan Huei See, Ruiping Wang, Michael R. Rice, Hari Ponnekanti +1 more | 2024-06-04 |
| 11854886 | Methods of TSV formation for advanced packaging | Peng Suo, Guan Huei See, Chang Bum Yong, Arvind Sundarrajan | 2023-12-26 |
| 11837464 | Methods, systems, and apparatus for tape-frame substrate cleaning and drying | Guan Huei See, Gregory J. Wilson | 2023-12-05 |
| 11756925 | Methods and apparatus for vacuum processing a substrate | Ruiping Wang | 2023-09-12 |
| 11404318 | Methods of forming through-silicon vias in substrates for advanced packaging | Peng Suo, Guan Huei See, Chang Bum Yong, Arvind Sundarrajan | 2022-08-02 |
| 8202440 | Methods and apparatus for electron beam assisted etching at low temperatures | Mehran Nasser-Ghodsi, Harrison H. Chin, Anne Testoni, R. Chris Burns | 2012-06-19 |
| 7902673 | Semiconductor device | — | 2011-03-08 |
| 7875990 | Wind-energy power machine and storage energy power generating system and wind-driven power generating system | Qingwan Lin | 2011-01-25 |
| 7777363 | Wind engine and wind power system | Qingwan Lin | 2010-08-17 |
| 7723130 | Tooling method for fabricating a semiconductor device and semiconductor devices fabricated thereof | — | 2010-05-25 |
| 6924484 | Void characterization in metal interconnect structures using X-ray emission analyses | Anne Testoni | 2005-08-02 |
| 6777676 | Non-destructive root cause analysis on blocked contact or via | Yeishin Tung, Anne Testoni | 2004-08-17 |
| 6763580 | Method and apparatus for securing an electrically conductive interconnect through a metallic substrate | Stanton Rak | 2004-07-20 |
| 6749105 | Method and apparatus for securing a metallic substrate to a metallic housing | Thomas P. Gall | 2004-06-15 |
| 6449158 | Method and apparatus for securing an electronic power device to a heat spreader | Clark D. Fischbach, Robert A. Richter | 2002-09-10 |