Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374586 | Methods of TSV formation for advanced packaging | Ying Wang, Guan Huei See, Chang Bum Yong, Arvind Sundarrajan | 2025-07-29 |
| 11854886 | Methods of TSV formation for advanced packaging | Ying Wang, Guan Huei See, Chang Bum Yong, Arvind Sundarrajan | 2023-12-26 |
| 11791094 | Semiconductor substrate having magnetic core inductor | Yu Gu, Guan Huei See, Arvind Sundarrajan | 2023-10-17 |
| 11404318 | Methods of forming through-silicon vias in substrates for advanced packaging | Ying Wang, Guan Huei See, Chang Bum Yong, Arvind Sundarrajan | 2022-08-02 |
| 11373803 | Method of forming a magnetic core on a substrate | Yu Gu, Guan Huei See, Arvind Sundarrajan | 2022-06-28 |
| 10636696 | Methods for forming vias in polymer layers | Yu Gu, Guan Huei See, Prayudi Lianto, Arvind Sundarrajan | 2020-04-28 |
| 10475735 | Methods and apparatus for 3D MIM capacitor package processing | Guan Huei See, Arvind Sundarrajan | 2019-11-12 |