Patents per Year
Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12374586 | Methods of TSV formation for advanced packaging | Ying Wang, Guan Huei See, Chang Bum Yong, Arvind Sundarrajan | 2025-07-29 | |
| 11854886 | Methods of TSV formation for advanced packaging | Ying Wang, Guan Huei See, Chang Bum Yong, Arvind Sundarrajan | 2023-12-26 | $30,871,000 |
| 11791094 | Semiconductor substrate having magnetic core inductor | Yu Gu, Guan Huei See, Arvind Sundarrajan | 2023-10-17 | $42,568,000 |
| 11404318 | Methods of forming through-silicon vias in substrates for advanced packaging | Ying Wang, Guan Huei See, Chang Bum Yong, Arvind Sundarrajan | 2022-08-02 | $46,822,000 |
| 11373803 | Method of forming a magnetic core on a substrate | Yu Gu, Guan Huei See, Arvind Sundarrajan | 2022-06-28 | $26,475,000 |
| 10636696 | Methods for forming vias in polymer layers | Yu Gu, Guan Huei See, Prayudi Lianto, Arvind Sundarrajan | 2020-04-28 | $15,875,000 |
| 10475735 | Methods and apparatus for 3D MIM capacitor package processing | Guan Huei See, Arvind Sundarrajan | 2019-11-12 | $41,829,000 |