Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Void characterization in metal interconnect structures using X-ray emission analyses

Void characterization in metal interconnect structures using X-ray emission analyses

US Patent 6924484 · Granted Aug 2, 2005

Estimated economic value: $63,200,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Procedure to enable die rework for hybrid bonding2025
Electronic apparatus and command accessing method thereof having power saving me2025
Methods of TSV formation for advanced packaging2025
On-board cleaning of tooling parts in hybrid bonding tool2025
Methods, systems, and apparatus for tape-frame substrate cleaning and drying2024
Apparatus for environmental control of dies and substrates for hybrid bonding2024
Methods of TSV formation for advanced packaging2023
Methods, systems, and apparatus for tape-frame substrate cleaning and drying2023
Methods and apparatus for vacuum processing a substrate2023
Methods of forming through-silicon vias in substrates for advanced packaging2022
Electron beam sterilization apparatus2014
Electron beam sterilization apparatus2012