Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11931855 | Planarization methods for packaging substrates | Han-Wen Chen, Steven Verhaverbeke, Tapash Chakraborty, Prayudi Lianto, Prerna Goradia +3 more | 2024-03-19 |
| 11289387 | Methods and apparatus for backside via reveal processing | Prayudi Lianto, Sik Hin Chi, SHIH-CHAO HUNG, Ricardo Fujii Vinluan, Gaurav Mehta +10 more | 2022-03-29 |