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Home › Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration

Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration

US Patent 11264333 · Granted Mar 1, 2022

Estimated economic value: $41,046,000 ⓘ

Assignee

Applied Materials

Inventors

Han-Wen Chen (49 patents)
Steven Verhaverbeke (136 patents)
Guan Huei See (48 patents)
Giback Park (29 patents)
Giorgio Cellere (15 patents)
Diego Tonini (9 patents)
Vincent DiCaprio (51 patents)
Kyuil Cho (32 patents)

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