| 12434347 |
Method for CMP temperature control |
Hailin Wu, Shih-Chiehmr Chang, Chih-Che Chou, Jianshe Tang, Hui Chen +1 more |
2025-10-07 |
|
| 12400881 |
Apparatus and method of substrate edge cleaning and substrate carrier head gap cleaning |
Wei Lu, Jimin Zhang, Jianshe Tang |
2025-08-26 |
|
| 12343840 |
Control of processing parameters for substrate polishing with substrate precession |
Eric Lau, Charles C. Garretson, Huanbo Zhang, Zhize Zhu, Benjamin Cherian +1 more |
2025-07-01 |
|
| 12296427 |
Apparatus and method for CMP temperature control |
Haosheng Wu, Shou-Sung Chang, Chih Chung Chou, Jianshe Tang, Hui Chen +1 more |
2025-05-13 |
|
| 12285838 |
Wafer edge asymmetry correction using groove in polishing pad |
Jimin Zhang, Jianshe Tang, Wei Lu, Priscilla Diep LaRosa |
2025-04-29 |
|
| 12224186 |
Apparatus and method of brush cleaning using periodic chemical treatments |
— |
2025-02-11 |
|
| 12198944 |
Substrate handling in a modular polishing system with single substrate cleaning chambers |
Ekaterina A. Mikhaylichenko, Jin Ji, Jagan Rangarajan, Steven M. Zuniga |
2025-01-14 |
|
| 12194591 |
Roller for location-specific wafer polishing |
Ekaterina A. Mikhaylichenko, Fred C. Redeker, Chirantha Rodrigo, Steven M. Zuniga, Jay Gurusamy |
2025-01-14 |
|
| 12051599 |
Cleaning method with in-line SPM processing |
Ekaterina A. Mikhaylichenko, Brian K. Kirkpatrick |
2024-07-30 |
$79,851,000 |
| 12030156 |
Polishing carrier head with piezoelectric pressure control |
Andrew J. Nagengast, Justin Ho Kuen Wong |
2024-07-09 |
$62,454,000 |
| 12027382 |
Surface cleaning with directed high pressure chemistry |
Brian K. Kirkpatrick, Ekaterina A. Mikhaylichenko |
2024-07-02 |
$85,126,000 |
| 11951589 |
Wafer edge asymmetry correction using groove in polishing pad |
Jimin Zhang, Jianshe Tang, Wei Lu, Priscilla Diep |
2024-04-09 |
$47,694,000 |
| 11931854 |
Chemical mechanical polishing using time share control |
Jimin Zhang, Jianshe Tang, Wei Lu, Priscilla Diep LaRosa |
2024-03-19 |
$54,086,000 |
| 11931853 |
Control of processing parameters for substrate polishing with angularly distributed zones using cost function |
Eric Lau, Charles C. Garretson, Huanbo Zhang, Zhize Zhu, Benjamin Cherian +1 more |
2024-03-19 |
$54,086,000 |
| 11897079 |
Low-temperature metal CMP for minimizing dishing and corrosion, and improving pad asperity |
Haosheng Wu, Hari Soundararajan, Jianshe Tang, Shou-Sung Chang, Yen-Chu Yang +2 more |
2024-02-13 |
$47,589,000 |
| 11890715 |
Polishing carrier head with piezoelectric pressure control |
Andrew J. Nagengast, Justin Ho Kuen Wong |
2024-02-06 |
$39,056,000 |
| 11826872 |
Temperature and slurry flow rate control in CMP |
Haosheng Wu, Jianshe Tang, Shih-Haur Shen, Shou-Sung Chang, Hari Soundararajan |
2023-11-28 |
$39,424,000 |
| 11823916 |
Apparatus and method of substrate edge cleaning and substrate carrier head gap cleaning |
Wei Lu, Jimin Zhang, Jianshe Tang |
2023-11-21 |
$39,416,000 |
| 11764069 |
Asymmetry correction via variable relative velocity of a wafer |
Jimin Zhang, Eric Lau, Ekaterina A. Mikhaylichenko, Jeonghoon Oh, Gerald Alonzo |
2023-09-19 |
$44,467,000 |
| 11682567 |
Cleaning system with in-line SPM processing |
Ekaterina A. Mikhaylichenko, Brian K. Kirkpatrick |
2023-06-20 |
$48,645,000 |
| 11400560 |
Retaining ring design |
Jeonghoon Oh, Charles C. Garretson, Eric Lau, Andrew J. Nagengast, Steven M. Zuniga +2 more |
2022-08-02 |
$46,822,000 |
| 11298794 |
Chemical mechanical polishing using time share control |
Jimin Zhang, Jianshe Tang, Wei Lu, Priscilla Diep |
2022-04-12 |
$58,287,000 |
| 11267095 |
High throughput polishing system for workpieces |
Stephen M Fisher, II, Robindranath Banerjee, Christopher Laurent Beaudry |
2022-03-08 |
|
| 10932323 |
Reflector and susceptor assembly for chemical vapor deposition reactor |
Brian H. Burrows, Abril Cabreros, David Masayuki Ishikawa, Alexander Lerner |
2021-02-23 |
|
| 10672628 |
Single use rinse in a linear Marangoni drier |
— |
2020-06-02 |
$65,790,000 |
