| 12194591 |
Roller for location-specific wafer polishing |
Ekaterina A. Mikhaylichenko, Brian J. Brown, Chirantha Rodrigo, Steven M. Zuniga, Jay Gurusamy |
2025-01-14 |
|
| 12023853 |
Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
Kasiraman Krishnan, Daniel Redfield, Russell Edward Perry, Gregory E. Menk, Rajeev Bajaj +3 more |
2024-07-02 |
$85,126,000 |
| 11980992 |
Integrated abrasive polishing pads and manufacturing methods |
Ashavani Kumar, Ashwin CHOCKALINGAM, Sivapackia Ganapathiappan, Rajeev Bajaj, Boyi Fu +6 more |
2024-05-14 |
$61,768,000 |
| 11958162 |
CMP pad construction with composite material properties using additive manufacturing processes |
Rajeev Bajaj, Kasiraman Krishnan, Mahendra C. ORILALL, Daniel Redfield, Nag B. Patibandla +4 more |
2024-04-16 |
$82,852,000 |
| 11780046 |
Polishing system with annular platen or polishing pad |
Paul D. Butterfield, Thomas H. Osterheld, Jeonghoon Oh, Shou-Sung Chang, Steven M. Zuniga |
2023-10-10 |
$39,034,000 |
| 11511388 |
Polishing system with support post and annular platen or polishing pad |
Paul D. Butterfield, Thomas H. Osterheld, Jeonghoon Oh, Shou-Sung Chang, Steven M. Zuniga |
2022-11-29 |
$23,914,000 |
| 11471999 |
Integrated abrasive polishing pads and manufacturing methods |
Ashavani Kumar, Ashwin CHOCKALINGAM, Sivapackia Ganapathiappan, Rajeev Bajaj, Boyi Fu +6 more |
2022-10-18 |
$26,737,000 |
| 11446788 |
Precursor formulations for polishing pads produced by an additive manufacturing process |
Rajeev Bajaj, Daniel Redfield, Mahendra C. ORILALL, Boyi Fu, Ashwin CHOCKALINGAM +2 more |
2022-09-20 |
$25,949,000 |
| 10875145 |
Polishing pads produced by an additive manufacturing process |
Rajeev Bajaj, Daniel Redfield, Mahendra C. ORILALL, Boyi Fu, Aniruddh Jagdish Khanna +12 more |
2020-12-29 |
$47,583,000 |
| 10821573 |
Polishing pads produced by an additive manufacturing process |
Rajeev Bajaj, Daniel Redfield, Mahendra C. ORILALL, Boyi Fu, Aniruddh Jagdish Khanna +12 more |
2020-11-03 |
$108,601,000 |
| 10800000 |
Multi-layered nano-fibrous CMP pads |
Robert D. Tolles, Mahendra C. ORILALL, Rajeev Bajaj |
2020-10-13 |
$51,568,000 |
| 10786885 |
Thin plastic polishing article for CMP applications |
Robert D. Tolles, Gregory E. Menk, Eric Davey, You Wang, Huyen Karen Tran +3 more |
2020-09-29 |
$24,138,000 |
| 10562147 |
Polishing system with annular platen or polishing pad for substrate monitoring |
Paul D. Butterfield, Thomas H. Osterheld, Jeonghoon Oh, Shou-Sung Chang, Steven M. Zuniga |
2020-02-18 |
$26,722,000 |
| 10537974 |
CMP pad construction with composite material properties using additive manufacturing processes |
Rajeev Bajaj, Kasiraman Krishnan, Mahendra C. ORILALL, Daniel Redfield, Nag B. Patibandla +4 more |
2020-01-21 |
$34,637,000 |
| 10493691 |
Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
Kasiraman Krishnan, Daniel Redfield, Russell Edward Perry, Gregory E. Menk, Rajeev Bajaj +3 more |
2019-12-03 |
$22,017,000 |
| 10456886 |
Porous chemical mechanical polishing pads |
Sivapackia Ganapathiappan, Nag B. Patibandla, Rajeev Bajaj, Daniel Redfield, Mahendra C. ORILALL +3 more |
2019-10-29 |
$23,960,000 |
| 10384330 |
Polishing pads produced by an additive manufacturing process |
Rajeev Bajaj, Daniel Redfield, Mahendra C. ORILALL, Boyi Fu, Aniruddh Jagdish Khanna +12 more |
2019-08-20 |
$26,004,000 |
| 10322491 |
Printed chemical mechanical polishing pad |
Mahendra C. ORILALL, Timothy Michaelson, Kasiraman Krishnan, Rajeev Bajaj, Nag B. Patibandla +2 more |
2019-06-18 |
$21,126,000 |
| 10199281 |
Substrate features for inductive monitoring of conductive trench depth |
Wei Lu, Zhihong Wang, Wen-Chiang Tu, Zhefu Wang, Hassan G. Iravani +2 more |
2019-02-05 |
$20,569,000 |
| 10086500 |
Method of manufacturing a UV curable CMP polishing pad |
Mahendra C. ORILALL, Rajeev Bajaj |
2018-10-02 |
$29,675,000 |
| 9911664 |
Substrate features for inductive monitoring of conductive trench depth |
Wei Lu, Zhihong Wang, Wen-Chiang Tu, Zhefu Wang, Hassan G. Iravani +2 more |
2018-03-06 |
$32,877,000 |
| 9873180 |
CMP pad construction with composite material properties using additive manufacturing processes |
Rajeev Bajaj, Kasiraman Krishnan, Mahendra C. ORILALL, Daniel Redfield, Nag B. Patibandla +4 more |
2018-01-23 |
$41,300,000 |
| 9776361 |
Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
Kasiraman Krishnan, Daniel Redfield, Russell Edward Perry, Gregory E. Menk, Rajeev Bajaj +3 more |
2017-10-03 |
$36,306,000 |
| 9669512 |
CMP pads having material composition that facilitates controlled conditioning |
Rajeev Bajaj, Craig E. Bohn |
2017-06-06 |
$20,400,000 |
| 9486893 |
Conditioning of grooving in polishing pads |
Hung Chih Chen, Rajeev Bajaj, Brian J. Brown, Robert Lum |
2016-11-08 |
$17,585,000 |
