Issued Patents All Time
Showing 1–25 of 169 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12283334 | Method and apparatus for memory testing | — | 2025-04-22 |
| 12274058 | Memory device | Chun-Hsiung Hung | 2025-04-08 |
| RE50357 | Three-dimensional semiconductor device | — | 2025-03-25 |
| 12009053 | Memory device and data searching method thereof | — | 2024-06-11 |
| 11960759 | Memory device and data searching method thereof | — | 2024-04-16 |
| 11934235 | Server and storage module | Cong Yang | 2024-03-19 |
| 11894356 | Chip having multiple functional units and semiconductor structure using the same | — | 2024-02-06 |
| 11800704 | Memory device and manufacturing method for the same | — | 2023-10-24 |
| 11775822 | Classification model training using diverse training source and inference engine using same | Tzu-Hsiang Su | 2023-10-03 |
| 11569227 | Three-way switch array structure and switch array substrate based on NVM | Ming-Hsiu Lee | 2023-01-31 |
| 11514300 | Resistor circuit, artificial intelligence chip and method for manufacturing the same | — | 2022-11-29 |
| 11455534 | Data set cleaning for artificial neural network training | — | 2022-09-27 |
| 11362195 | Semiconductor device and a method for forming a semiconductor device | Dimitri Linten | 2022-06-14 |
| 11289130 | Memory device | — | 2022-03-29 |
| 11233049 | Neuromorphic computing device | — | 2022-01-25 |
| 11177202 | Multilayer structure and method for fabricating the same | — | 2021-11-16 |
| 10833015 | 3D NAND word line connection structure | — | 2020-11-10 |
| 10700004 | 3D NAND world line connection structure | — | 2020-06-30 |
| 10680098 | High voltage tolerant LDMOS | Dimitri Linten, Geert Hellings | 2020-06-09 |
| 10424579 | Tunable electrostatic discharge clamp | Mirko Scholz | 2019-09-24 |
| 10332903 | Multi-layer structure and a method for manufacturing the same and a corresponding contact structure | — | 2019-06-25 |
| 10332936 | 3D stacking semiconductor device | — | 2019-06-25 |
| 10211150 | Memory structure | — | 2019-02-19 |
| 10103164 | Three-dimensional semiconductor device | — | 2018-10-16 |
| 10090232 | Bumpless fan-out chip stacking structure and method for fabricating the same | — | 2018-10-02 |