Issued Patents All Time
Showing 51–75 of 169 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9373632 | Twisted array design for high speed vertical channel 3D NAND memory | — | 2016-06-21 |
| 9373403 | 3D NAND memory device and operation thereof | — | 2016-06-21 |
| 9368507 | Semiconductor structure | — | 2016-06-14 |
| 9368379 | Systems and methods of controlling semiconductor wafer fabrication processes | Ying Xiao, Chin-Hsiang Lin | 2016-06-14 |
| 9368046 | Color tactile vision system | Yi-Chou Chen, Yu-Yu Lin, Tung-Hua Chuang | 2016-06-14 |
| 9343322 | Three dimensional stacking memory film structure | — | 2016-05-17 |
| 9293471 | Semiconductor apparatus and manufacturing method of the same | — | 2016-03-22 |
| 9276009 | NAND-connected string of transistors having the electrical channel in a direction perpendicular to a surface of the substrate | — | 2016-03-01 |
| 9269660 | Multilayer connection structure | Hang-Ting Lue, Hong-Ji Lee, Chin-Cheng Yang | 2016-02-23 |
| 9252023 | Etching method and apparatus | Chien-An Chen, Ying Xiao, Ying Zhang | 2016-02-02 |
| 9240405 | Memory with off-chip controller | Hang-Ting Lue, Kuang Yeu Hsieh | 2016-01-19 |
| 9224473 | Word line repair for 3D vertical channel memory | — | 2015-12-29 |
| 9224611 | Semiconductor structure and manufacturing method and operating method of the same | Hang-Ting Lue | 2015-12-29 |
| 9219073 | Parallelogram cell design for high speed vertical channel 3D NAND memory | — | 2015-12-22 |
| 9219074 | Three-dimensional semiconductor device | — | 2015-12-22 |
| 9219053 | Three dimensional stacked multi-chip structure and manufacturing method of the same | — | 2015-12-22 |
| 9202750 | Stacked 3D memory with isolation layer between memory blocks and access conductors coupled to decoding elements in memory blocks | — | 2015-12-01 |
| 9196628 | 3D stacked IC device with stepped substack interlayer connectors | — | 2015-11-24 |
| 9165823 | 3D stacking semiconductor device and manufacturing method thereof | — | 2015-10-20 |
| 9147672 | Three-dimensional multiple chip packages including multiple chip stacks | — | 2015-09-29 |
| 9140976 | Mask design with optically isolated via and proximity correction features | Chih-Chang Hsieh, Hang-Ting Lue | 2015-09-22 |
| 9142538 | Three-dimensional semiconductor device | — | 2015-09-22 |
| 9111597 | Memory device structure with decoders in a device level separate from the array level | — | 2015-08-18 |
| 9087849 | Electrostatic discharge protection devices | Dimitri Linten | 2015-07-21 |
| 9082656 | NAND flash with non-trapping switch transistors | Hang-Ting Lue, Yen-Hao Shih | 2015-07-14 |