SC

Shih-Hung Chen

MC Macronix International Co.: 147 patents #5 of 1,241Top 1%
IT ITRI: 7 patents #918 of 9,619Top 10%
TSMC: 6 patents #3,824 of 12,232Top 35%
IBM: 5 patents #18,733 of 70,183Top 30%
IV Imec Vzw: 4 patents #144 of 1,046Top 15%
QA Qimonda Ag: 2 patents #17 of 64Top 30%
UM United Microelectronics: 2 patents #1,942 of 4,560Top 45%
WI Wiwynn: 1 patents #73 of 151Top 50%
AC Asustek Computer: 1 patents #655 of 1,430Top 50%
📍 Hsinchu, NY: #2 of 65 inventorsTop 4%
Overall (All Time): #4,816 of 4,157,543Top 1%
169
Patents All Time

Issued Patents All Time

Showing 101–125 of 169 patents

Patent #TitleCo-InventorsDate
8836137 Method for creating a 3D stacked multichip module 2014-09-16
8815655 Method for manufacturing semiconductor device 2014-08-26
8811077 Memory architecture of 3D array with improved uniformity of bit line capacitances Chun-Hsiung Hung, Hang-Ting Lue 2014-08-19
8759217 Method for forming interlayer connectors to a stack of conductive layers 2014-06-24
8759899 Integration of 3D stacked IC device with peripheral circuits Hang-Ting Lue, Yi-Hsuan Hsiao, Yen-Hao Shih 2014-06-24
8704205 Semiconductor structure with improved capacitance of bit line Hang-Ting Lue, Kuang Yeu Hsieh, Erh-Kun Lai, Yen-Hao Shih 2014-04-22
8692379 Integrated circuit connector access region 2014-04-08
8664689 Memory cell access device having a pn-junction with polycrystalline plug and single-crystal semiconductor regions Hsiang-Lan Lung, Erh-Kun Lai, Yen-Hao Shih, Yi-Chou Chen 2014-03-04
8659949 Three-dimensional memory structure and method of operating the same hydride 2014-02-25
8644077 Memory device, manufacturing method and operating method of the same Hang-Ting Lue 2014-02-04
8643078 Semiconductor structure and manufacturing method of the same Hang-Ting Lue, Kuang Yeu Hsieh 2014-02-04
8633099 Method for forming interlayer connectors in a three-dimensional stacked IC device Yen-Hao Shih, Teng-Hao Yeh, Chih-Wei Hu, Feng-Nien Tsai, Lo-Yueh Lin 2014-01-21
8604555 Semiconductor structure and manufacturing method of the same Kuang Yeu Hsieh 2013-12-10
8598032 Reduced number of masks for IC device with stacked contact levels Hang-Ting Lue 2013-12-03
8574992 Contact architecture for 3D memory array Yen-Hao Shih, Hang-Ting Lue 2013-11-05
8558394 Chip stack structure and manufacturing method thereof 2013-10-15
8541882 Stacked IC device with recessed conductive layers adjacent to interlevel conductors Yan-Ru Chen, Lo-Yueh Lin 2013-09-24
8536559 Phase change memory 2013-09-17
8503213 Memory architecture of 3D array with alternating memory string orientation and string select structures Hang-Ting Lue 2013-08-06
8492216 Semiconductor structure with contact structure and manufacturing method of the same 2013-07-23
8445313 Method for forming a self-aligned bit line for PCRAM and self-aligned etch back process Matthew J. Breitwisch, Chieh-Fang Chen, Eric A. Joseph, Chung H. Lam, Michael F. Lofaro +3 more 2013-05-21
8383512 Method for making multilayer connection structure Hang-Ting Lue, Hong-Ji Lee, Chin-Cheng Yang 2013-02-26
8363476 Memory device, manufacturing method and operating method of the same Hang-Ting Lue 2013-01-29
8344347 Multi-layer electrode structure 2013-01-01
8304911 Semiconductor structure and manufacturing method of the same Hang-Ting Lue, Yi-Hsuan Hsiao 2012-11-06