Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11986922 | Techniques for combining CMP process tracking data with 3D printed CMP consumables | Jason Garcheung Fung, Rajeev Bajaj, Daniel Redfield, Mario CORNEJO, Gregory E. Menk +1 more | 2024-05-21 |
| 11911870 | Polishing pads for high temperature processing | Sivapackia Ganapathiappan, Rajeev Bajaj, Yingdong Luo, You Wang, Daniel Redfield | 2024-02-27 |
| 11813712 | Polishing pads having selectively arranged porosity | Jason Garcheung Fung, Puneet Narendra JAWALI, Rajeev Bajaj, Adam W. Manzonie, Nandan BARADANAHALLI KENCHAPPA +4 more | 2023-11-14 |
| 11724362 | Polishing pads produced by an additive manufacturing process | Rajeev Bajaj, Daniel Redfield, Mahendra C. ORILALL, Boyi Fu, Jason Garcheung Fung +5 more | 2023-08-15 |
| 10875145 | Polishing pads produced by an additive manufacturing process | Rajeev Bajaj, Daniel Redfield, Mahendra C. ORILALL, Boyi Fu, Jason Garcheung Fung +12 more | 2020-12-29 |
| 10821573 | Polishing pads produced by an additive manufacturing process | Rajeev Bajaj, Daniel Redfield, Mahendra C. ORILALL, Boyi Fu, Jason Garcheung Fung +12 more | 2020-11-03 |
| 10593574 | Techniques for combining CMP process tracking data with 3D printed CMP consumables | Jason Garcheung Fung, Rajeev Bajaj, Daniel Redfield, Mario CORNEJO, Gregory E. Menk +1 more | 2020-03-17 |
| 10384330 | Polishing pads produced by an additive manufacturing process | Rajeev Bajaj, Daniel Redfield, Mahendra C. ORILALL, Boyi Fu, Jason Garcheung Fung +12 more | 2019-08-20 |