Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11986922 | Techniques for combining CMP process tracking data with 3D printed CMP consumables | Jason Garcheung Fung, Rajeev Bajaj, Daniel Redfield, Aniruddh Jagdish Khanna, Gregory E. Menk +1 more | 2024-05-21 |
| 11980992 | Integrated abrasive polishing pads and manufacturing methods | Ashavani Kumar, Ashwin CHOCKALINGAM, Sivapackia Ganapathiappan, Rajeev Bajaj, Boyi Fu +6 more | 2024-05-14 |
| 11685014 | Formulations for advanced polishing pads | Sivapackia Ganapathiappan, Ankit Vora, Boyi Fu, Venkat Hariharan, Mayu YAMAMURA +5 more | 2023-06-27 |
| 11471999 | Integrated abrasive polishing pads and manufacturing methods | Ashavani Kumar, Ashwin CHOCKALINGAM, Sivapackia Ganapathiappan, Rajeev Bajaj, Boyi Fu +6 more | 2022-10-18 |
| 11072050 | Polishing pad with window and manufacturing methods thereof | Boyi Fu, Sivapackia Ganapathiappan, Daniel Redfield, Rajeev Bajaj, Ashwin CHOCKALINGAM +4 more | 2021-07-27 |
| 10875145 | Polishing pads produced by an additive manufacturing process | Rajeev Bajaj, Daniel Redfield, Mahendra C. ORILALL, Boyi Fu, Aniruddh Jagdish Khanna +12 more | 2020-12-29 |
| 10821573 | Polishing pads produced by an additive manufacturing process | Rajeev Bajaj, Daniel Redfield, Mahendra C. ORILALL, Boyi Fu, Aniruddh Jagdish Khanna +12 more | 2020-11-03 |
| 10773509 | Pad structure and fabrication methods | Hou T. Ng, Nag B. Patibandla, Rajeev Bajaj, Daniel Redfield, Ashwin CHOCKALINGAM +1 more | 2020-09-15 |
| 10593574 | Techniques for combining CMP process tracking data with 3D printed CMP consumables | Jason Garcheung Fung, Rajeev Bajaj, Daniel Redfield, Aniruddh Jagdish Khanna, Gregory E. Menk +1 more | 2020-03-17 |
| 10384330 | Polishing pads produced by an additive manufacturing process | Rajeev Bajaj, Daniel Redfield, Mahendra C. ORILALL, Boyi Fu, Aniruddh Jagdish Khanna +12 more | 2019-08-20 |