| 7061120 |
Stackable semiconductor package having semiconductor chip within central through hole of substrate |
WonSun Shin, Sangho Lee, SeonGoo Lee, Vincent DiCaprio |
2006-06-13 |
| 6830955 |
Semiconductor package and method for manufacturing the same |
WonSun Shin, SeonGoo Lee, Sangho Lee, Vincent DiCaprio |
2004-12-14 |
| 6797541 |
Leadless semiconductor product packaging apparatus having a window lid and method for packaging |
Sung Chul Chang |
2004-09-28 |
| 6762078 |
Semiconductor package having semiconductor chip within central aperture of substrate |
WonSun Shin, Sangho Lee, SeonGoo Lee, Vincent DiCaprio |
2004-07-13 |
| 6525405 |
Leadless semiconductor product packaging apparatus having a window lid and method for packaging |
Sung Chul Chang |
2003-02-25 |
| 6512288 |
Circuit board semiconductor package |
WonSun Shin, SeonGoo Lee, TaeHoan Jang, Vincent DiCaprio |
2003-01-28 |
| 6501184 |
Semiconductor package and method for manufacturing the same |
WonSun Shin, SeonGoo Lee, Sangho Lee, Vincent DiCaprio |
2002-12-31 |
| 6395578 |
Semiconductor package and method for fabricating the same |
WonSun Shin, Sangho Lee, SeonGoo Lee, Vincent DiCaprio |
2002-05-28 |