Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8129845 | Semiconductor device and method of forming interconnect structure in non-active area of wafer | JaeHun Ku, Xusheng Bao | 2012-03-06 |
| 6512288 | Circuit board semiconductor package | WonSun Shin, SeonGoo Lee, DoSung Chun, Vincent DiCaprio | 2003-01-28 |