Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7061120 | Stackable semiconductor package having semiconductor chip within central through hole of substrate | DoSung Chun, Sangho Lee, SeonGoo Lee, Vincent DiCaprio | 2006-06-13 |
| 6830955 | Semiconductor package and method for manufacturing the same | DoSung Chun, SeonGoo Lee, Sangho Lee, Vincent DiCaprio | 2004-12-14 |
| 6762078 | Semiconductor package having semiconductor chip within central aperture of substrate | DoSung Chun, Sangho Lee, SeonGoo Lee, Vincent DiCaprio | 2004-07-13 |
| 6512288 | Circuit board semiconductor package | SeonGoo Lee, TaeHoan Jang, DoSung Chun, Vincent DiCaprio | 2003-01-28 |
| 6501184 | Semiconductor package and method for manufacturing the same | DoSung Chun, SeonGoo Lee, Sangho Lee, Vincent DiCaprio | 2002-12-31 |
| 6395578 | Semiconductor package and method for fabricating the same | DoSung Chun, Sangho Lee, SeonGoo Lee, Vincent DiCaprio | 2002-05-28 |