Issued Patents All Time
Showing 26–49 of 49 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6982488 | Semiconductor package and method for fabricating the same | Won Sun Shin, Do Sung Chun, Soon Goo Lee, Il Kwon Shim | 2006-01-03 |
| 6830955 | Semiconductor package and method for manufacturing the same | WonSun Shin, DoSung Chun, SeonGoo Lee, Sangho Lee | 2004-12-14 |
| 6798049 | Semiconductor package and method for fabricating the same | Won Sun Shin, Do Sung Chun, Seon Goo Lee, Il Kwon Shim | 2004-09-28 |
| 6762078 | Semiconductor package having semiconductor chip within central aperture of substrate | WonSun Shin, DoSung Chun, Sangho Lee, SeonGoo Lee | 2004-07-13 |
| 6717248 | Semiconductor package and method for fabricating the same | Won Sun Shin, Seon Goo Lee, Do Sung Chun, Tae Hoan Jang | 2004-04-06 |
| 6683377 | Multi-stacked memory package | Il Kwon Shim | 2004-01-27 |
| 6656765 | Fabricating very thin chip size semiconductor packages | — | 2003-12-02 |
| 6650019 | Method of making a semiconductor package including stacked semiconductor dies | Thomas P. Glenn, Lee Smith, David Zoba, Kambhampati Ramakrishna | 2003-11-18 |
| 6624005 | Semiconductor memory cards and method of making same | Kenneth Kaskoun | 2003-09-23 |
| 6589801 | Wafer-scale production of chip-scale semiconductor packages using wafer mapping techniques | Ju Hoon Yoon, Dae Byung Kang, In Bae Park, Markus K. Liebhard | 2003-07-08 |
| 6577013 | Chip size semiconductor packages with stacked dies | Thomas P. Glenn, Steven Webster | 2003-06-10 |
| 6531784 | Semiconductor package with spacer strips | Il Kwon Shim, Kambhampati Ramakrishna | 2003-03-11 |
| 6517656 | Method of making an integrated circuit package using a batch step for curing a die attachment film and a tool system for performing the method | — | 2003-02-11 |
| 6515356 | Semiconductor package and method for fabricating the same | Won Sun Shin, Seon Goo Lee, Do Sung Chun, Tae Hoan Jang | 2003-02-04 |
| 6512288 | Circuit board semiconductor package | WonSun Shin, SeonGoo Lee, TaeHoan Jang, DoSung Chun | 2003-01-28 |
| 6501184 | Semiconductor package and method for manufacturing the same | WonSun Shin, DoSung Chun, SeonGoo Lee, Sangho Lee | 2002-12-31 |
| 6489667 | Semiconductor device and method of manufacturing such device | Il Kwon Shim, Chang Kyu Park, Byung Joon Han, Paul R. Hoffman | 2002-12-03 |
| 6472758 | Semiconductor package including stacked semiconductor dies and bond wires | Thomas P. Glenn, Lee Smith, David Zoba, Kambhampati Ramakrishna | 2002-10-29 |
| 6462274 | Chip-scale semiconductor package of the fan-out type and method of manufacturing such packages | Il Kwon Shim, Chang Kyu Park, Byung Joon Han, Paul R. Hoffman | 2002-10-08 |
| 6452278 | Low profile package for plural semiconductor dies | Sean T. Crowley, J. Mark Bird | 2002-09-17 |
| 6414396 | Package for stacked integrated circuits | Il Kwon Shim, Paul R. Hoffman, Byung Joon Han | 2002-07-02 |
| 6406934 | Wafer level production of chip size semiconductor packages | Thomas P. Glenn, Steven Webster | 2002-06-18 |
| 6395578 | Semiconductor package and method for fabricating the same | WonSun Shin, DoSung Chun, Sangho Lee, SeonGoo Lee | 2002-05-28 |
| 6340846 | Making semiconductor packages with stacked dies and reinforced wire bonds | Anthony James LoBianco, Frank J. Juskey, Stephen G. Shermer, Thomas P. Glenn | 2002-01-22 |