Issued Patents All Time
Showing 51–75 of 107 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9245802 | Wafer dicing using femtosecond-based laser and plasma etch | Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar, James M. Holden | 2016-01-26 |
| 9245803 | Hybrid wafer dicing approach using a bessel beam shaper laser scribing process and plasma etch process | Jungrae Park, James S. Papanu, Brad Eaton, Ajay Kumar | 2016-01-26 |
| 9236305 | Wafer dicing with etch chamber shield ring for film frame wafer applications | Saravjeet Singh, Jivko Dinev, Aparna Iyer, Brad Eaton, Ajay Kumar | 2016-01-12 |
| 9224650 | Wafer dicing from wafer backside and front side | Brad Eaton, Ajay Kumar | 2015-12-29 |
| 9224625 | Laser and plasma etch wafer dicing using water-soluble die attach film | Madhava Rao Yalamanchili, Brad Eaton, Saravjeet Singh, Ajay Kumar | 2015-12-29 |
| 9218992 | Hybrid laser and plasma etch wafer dicing using substrate carrier | Saravjeet Singh, Brad Eaton, Ajay Kumar, James M. Holden, Madhava Rao Yalamanchili +1 more | 2015-12-22 |
| 9209084 | Maskless hybrid laser scribing and plasma etching wafer dicing process | Brad Eaton, James S. Papanu, Ajay Kumar | 2015-12-08 |
| 9196536 | Hybrid wafer dicing approach using a phase modulated laser beam profile laser scribing process and plasma etch process | Jungrae Park, James S. Papanu, Brad Eaton, Ajay Kumar | 2015-11-24 |
| 9177864 | Method of coating water soluble mask for laser scribing and plasma etch | Brad Eaton, Aparna Iyer, Todd Egan, Madhava Rao Yalamanchili, Ajay Kumar | 2015-11-03 |
| 9177861 | Hybrid wafer dicing approach using laser scribing process based on an elliptical laser beam profile or a spatio-temporal controlled laser beam profile | Jungrae Park, James S. Papanu, Brad Eaton, Ajay Kumar | 2015-11-03 |
| 9165832 | Method of die singulation using laser ablation and induction of internal defects with a laser | James S. Papanu, Jungrae Park, Alexander Lerner, Brad Eaton, Ajay Kumar | 2015-10-20 |
| 9159621 | Dicing tape protection for wafer dicing using laser scribe process | Brad Eaton, Ajay Kumar | 2015-10-13 |
| 9159624 | Vacuum lamination of polymeric dry films for wafer dicing using hybrid laser scribing and plasma etch approach | Prabhat Kumar, James S. Papanu, Brad Eaton, Ajay Kumar | 2015-10-13 |
| 9142459 | Wafer dicing using hybrid laser scribing and plasma etch approach with mask application by vacuum lamination | Prabhat Kumar, Brad Eaton, Ajay Kumar | 2015-09-22 |
| 9130057 | Hybrid dicing process using a blade and laser | Prabhat Kumar, James S. Papanu, Brad Eaton, Ajay Kumar | 2015-09-08 |
| 9126285 | Laser and plasma etch wafer dicing using physically-removable mask | Saravjeet Singh, Madhava Rao Yalamanchili, Brad Eaton, Ajay Kumar | 2015-09-08 |
| 9129904 | Wafer dicing using pulse train laser with multiple-pulse bursts and plasma etch | Saravjeet Singh, Madhava Rao Yalamanchili, Brad Eaton, Ajay Kumar | 2015-09-08 |
| 9130030 | Baking tool for improved wafer coating process | Jungrae Park, James S. Papanu, Brad Eaton, Ajay Kumar | 2015-09-08 |
| 9130056 | Bi-layer wafer-level underfill mask for wafer dicing and approaches for performing wafer dicing | James M. Holden, James S. Papanu, Brad Eaton, Ajay Kumar | 2015-09-08 |
| 9112050 | Dicing tape thermal management by wafer frame support ring cooling during plasma dicing | Prabhat Kumar, Brad Eaton, Ajay Kumar | 2015-08-18 |
| 9105710 | Wafer dicing method for improving die packaging quality | Brad Eaton, Aparna Iyer, Madhava Rao Yalamanchili, Ajay Kumar, Jungrae Park | 2015-08-11 |
| 9093518 | Singulation of wafers having wafer-level underfill | James S. Papanu, Brad Eaton, Ajay Kumar | 2015-07-28 |
| 9076860 | Residue removal from singulated die sidewall | Prabhat Kumar, James S. Papanu, Ajay Kumar, Brad Eaton | 2015-07-07 |
| 9054176 | Multi-step and asymmetrically shaped laser beam scribing | Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar, James M. Holden | 2015-06-09 |
| 9048309 | Uniform masking for wafer dicing using laser and plasma etch | Mohammad Kamruzzaman Chowdhury, Todd Egan, Brad Eaton, Madhava Rao Yalamanchili, Ajay Kumar | 2015-06-02 |