Issued Patents All Time
Showing 101–107 of 107 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8652940 | Wafer dicing used hybrid multi-step laser scribing process with plasma etch | Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar | 2014-02-18 |
| 8642448 | Wafer dicing using femtosecond-based laser and plasma etch | Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar, James M. Holden | 2014-02-04 |
| 8598016 | In-situ deposited mask layer for device singulation by laser scribing and plasma etch | Madhava Rao Yalamanchili, Brad Eaton, Saravjeet Singh, Ajay Kumar, Banqiu Wu | 2013-12-03 |
| 8557683 | Multi-step and asymmetrically shaped laser beam scribing | Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar, James M. Holden | 2013-10-15 |
| 8557682 | Multi-layer mask for substrate dicing by laser and plasma etch | James M. Holden, Brad Eaton, Todd Egan, Saravjeet Singh | 2013-10-15 |
| 8507363 | Laser and plasma etch wafer dicing using water-soluble die attach film | Madhava Rao Yalamanchili, Brad Eaton, Saravjeet Singh, Ajay Kumar | 2013-08-13 |
| 8129658 | Systems for thin film laser scribing devices | Antoine P. Manens | 2012-03-06 |