Issued Patents All Time
Showing 76–100 of 107 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9041198 | Maskless hybrid laser scribing and plasma etching wafer dicing process | Brad Eaton, James S. Papanu, Ajay Kumar | 2015-05-26 |
| 9018079 | Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate reactive post mask-opening clean | Brad Eaton, Madhava Rao Yalamanchili, Ajay Kumar | 2015-04-28 |
| 9012305 | Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate non-reactive post mask-opening clean | Jungrae Park, James S. Papanu, Brad Eaton, Ajay Kumar | 2015-04-21 |
| 8991329 | Wafer coating | Jungrae Park, Prabhat Kumar, James S. Papanu, Brad Eaton, Ajay Kumar | 2015-03-31 |
| 8993414 | Laser scribing and plasma etch for high die break strength and clean sidewall | Brad Eaton, Saravjeet Singh, Madhava Rao Yalamanchili, Tong Liu, Ajay Kumar | 2015-03-31 |
| 8980727 | Substrate patterning using hybrid laser scribing and plasma etching processing schemes | Brad Eaton, Ajay Kumar | 2015-03-17 |
| 8980726 | Substrate dicing by laser ablation and plasma etch damage removal for ultra-thin wafers | Aparna Iyer, Brad Eaton, Madhava Rao Yalamanchili, Ajay Kumar | 2015-03-17 |
| 8975163 | Laser-dominated laser scribing and plasma etch hybrid wafer dicing | James S. Papanu, Brad Eaton, Ajay Kumar | 2015-03-10 |
| 8975162 | Wafer dicing from wafer backside | Brad Eaton, Aparna Iyer, Saravjeet Singh, Madhava Rao Yalamanchili, Ajay Kumar | 2015-03-10 |
| 8969177 | Laser and plasma etch wafer dicing with a double sided UV-curable adhesive film | Mohammad Kamruzzaman Chowdhury, Todd Egan, Brad Eaton, Madhava Rao Yalamanchili, Ajay Kumar | 2015-03-03 |
| 8951819 | Wafer dicing using hybrid split-beam laser scribing process with plasma etch | Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar, Aparna Iyer | 2015-02-10 |
| 8946057 | Laser and plasma etch wafer dicing using UV-curable adhesive film | Mohammad Kamruzzaman Chowdhury, Todd Egan, Brad Eaton, Madhava Rao Yalamanchili, Ajay Kumar | 2015-02-03 |
| 8940619 | Method of diced wafer transportation | Brad Eaton, Aparna Iyer, Saravjeet Singh, Todd Egan, Ajay Kumar +1 more | 2015-01-27 |
| 8932939 | Water soluble mask formation by dry film lamination | James S. Papanu, Brad Eaton, Ajay Kumar | 2015-01-13 |
| 8927393 | Water soluble mask formation by dry film vacuum lamination for laser and plasma dicing | James S. Papanu, Prabhat Kumar, Brad Eaton, Ajay Kumar | 2015-01-06 |
| 8912078 | Dicing wafers having solder bumps on wafer backside | James S. Papanu, Aparna Iyer, Brad Eaton, Ajay Kumar | 2014-12-16 |
| 8912075 | Wafer edge warp supression for thin wafer supported by tape frame | Brad Eaton, Ajay Kumar | 2014-12-16 |
| 8912077 | Hybrid laser and plasma etch wafer dicing using substrate carrier | Saravjeet Singh, Brad Eaton, Ajay Kumar, James M. Holden, Madhava Rao Yalamanchili +1 more | 2014-12-16 |
| 8883614 | Wafer dicing with wide kerf by laser scribing and plasma etching hybrid approach | Brad Eaton, Apama Iyer, Madhava Rao Yalamanchili, Ajay Kumar | 2014-11-11 |
| 8883615 | Approaches for cleaning a wafer during hybrid laser scribing and plasma etching wafer dicing processes | James M. Holden, James S. Papanu, Ajay Kumar | 2014-11-11 |
| 8859397 | Method of coating water soluble mask for laser scribing and plasma etch | Brad Eaton, Aparna Iyer, Todd Egan, Madhava Rao Yalamanchili, Ajay Kumar | 2014-10-14 |
| 8853056 | Wafer dicing using femtosecond-based laser and plasma etch | Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar, James M. Holden | 2014-10-07 |
| 8845854 | Laser, plasma etch, and backside grind process for wafer dicing | Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar | 2014-09-30 |
| 8846498 | Wafer dicing using hybrid multi-step laser scribing process with plasma etch | Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar | 2014-09-30 |
| 8703581 | Water soluble mask for substrate dicing by laser and plasma etch | Saravjeet Singh, Madhava Rao Yalamanchili, Brad Eaton, Ajay Kumar | 2014-04-22 |