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Home › High density plasma etchback process for advanced metallization applications

High density plasma etchback process for advanced metallization applications

US Patent 8431033 · Granted Apr 30, 2013

Assignee

Novellus Systems

Inventors

Chunming Zhou (8 patents)
Liqi Wu (22 patents)
Karthik S. Colinjivadi (4 patents)
Emery Kuo (1 patents)
Huatan Qiu (22 patents)
KieJin Park (5 patents)

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