| D1071886 |
Substrate support for a substrate processing chamber |
Zhixiu Liang, Jiang Lu, Cheng-Hsiung Tsai, Tomoharu Matsushita, Zubin Huang |
2025-04-22 |
|
| 11835927 |
Reducing substrate surface scratching using machine learning |
Kartik Shah, Satish Radhakrishnan, Karthik Ramanathan, Karthikeyan Balaraman, Adolph Miller Allen +5 more |
2023-12-05 |
$45,995,000 |
| 11735420 |
Wafer treatment for achieving defect-free self-assembled monolayers |
Chang Ke, Lei Zhou, Biao Liu, Cheng Pan, Yuanhong Guo +5 more |
2023-08-22 |
$40,609,000 |
| 11586160 |
Reducing substrate surface scratching using machine learning |
Kartik Shah, Satish Radhakrishnan, Karthik Ramanathan, Karthikeyan Balaraman, Adolph Miller Allen +5 more |
2023-02-21 |
$24,540,000 |
| 11515155 |
Methods for enhancing selectivity in SAM-based selective deposition |
Chang Ke, Liqi Wu, Lei Zhou, Shuyi Zhang, David Thompson +3 more |
2022-11-29 |
$23,914,000 |
| 11033930 |
Methods and apparatus for cryogenic gas stream assisted SAM-based selective deposition |
Chang Ke, Song-Moon Suh, Liqi Wu, Lei Zhou, Biao Liu +3 more |
2021-06-15 |
$88,912,000 |
| 10950433 |
Methods for enhancing selectivity in SAM-based selective deposition |
Chang Ke, Liqi Wu, Lei Zhou, Shuyi Zhang, David Thompson +3 more |
2021-03-16 |
$56,717,000 |
| 10770292 |
Wafer treatment for achieving defect-free self-assembled monolayers |
Chang Ke, Lei Zhou, Biao Liu, Cheng Pan, Yuanhong Guo +5 more |
2020-09-08 |
$22,964,000 |
| 10643840 |
Selective deposition defects removal by chemical etch |
Jeffrey W. Anthis, Chang Ke, Pratham Jain, Benjamin Schmiege, Guoqiang Jian +3 more |
2020-05-05 |
$58,379,000 |
| 10593521 |
Substrate support for plasma etch operations |
Larry Frazier, Cheng-Hsiung Tsai, John C. Forster, Mei Po (Mabel) Yeung |
2020-03-17 |
$17,260,000 |
| 9275865 |
Plasma treatment of film for impurity removal |
Benjamin C. Wang, Joshua Collins, Avgerinos V. Gelatos, Amit Khandelwal |
2016-03-01 |
$12,540,000 |
| 9017776 |
Apparatuses and methods for atomic layer deposition |
Hyman Lam, Bo Zheng, Hua Ai, Xiaoxiong Yuan, Hou Gong Wang +2 more |
2015-04-28 |
$17,425,000 |
| 8747556 |
Apparatuses and methods for atomic layer deposition |
Hyman Lam, Bo Zheng, Hua Ai, Xiaoxiong Yuan, Hougong Wang +2 more |
2014-06-10 |
$12,688,000 |
| 8637410 |
Method for metal deposition using hydrogen plasma |
Anantha K. Subramani, John C. Forster, Seshadri Ganguli, Xinliang Lu, Wei Wang +2 more |
2014-01-28 |
$15,652,000 |
| 8293015 |
Apparatuses and methods for atomic layer deposition |
Hyman Lam, Bo Zheng, Hua Ai, Xiaoxiong Yuan, Hougong Wang +2 more |
2012-10-23 |
$4,153,000 |
| 8291857 |
Apparatuses and methods for atomic layer deposition |
Hyman Lam, Bo Zheng, Hua Ai, Xiaoxiong Yuan, Hou Gong Wang +2 more |
2012-10-23 |
$4,153,000 |
| 7705275 |
Substrate support having brazed plates and resistance heater |
Salvador P. Umotoy, Lawrence Chung-Lai Lei, Gwo-chun Tzu, Xiangxiong (John) Yuan, Hymam Lam |
2010-04-27 |
$16,065,000 |
| 6375753 |
Method and apparatus for removing processing liquid from a processing liquid delivery line |
Anish Tolia, Tushar Mandrekar |
2002-04-23 |
$30,581,000 |
| 6305392 |
Method and apparatus for removing processing liquid from a processing liquid delivery line |
Anish Tolia, Tushar Mandrekar |
2001-10-23 |
$163,024,000 |
| 6057244 |
Method for improved sputter etch processing |
Gilbert Hausmann, Vijay D. Parkhe, Chia-Ao William LU |
2000-05-02 |
$142,684,000 |
