| 12424363 |
Magnetic thin film laminated structure and micro-inductive device thereof |
Yujie Yang, Peijun Ding, Tongwen Zhang, Wei Xia |
2025-09-23 |
| 11699541 |
Magnetic thin film laminated structure deposition method |
Yujie Yang, Peijun Ding, Tongwen Zhang, Wei Xia |
2023-07-11 |
| 11328940 |
Degassing chamber and semiconductor processing apparatus |
Qiang Jia, Peijun Ding, Mengxin Zhao |
2022-05-10 |
| 11309208 |
Electrostatic chuck and method for manufacturing protrusions thereof |
Hua Ye, Quanyu Shi, Jinguo ZHENG |
2022-04-19 |
| 10886142 |
Annealing method, process chamber and annealing apparatus |
Zhimin BAI, Qiang Li, Bin Deng, Yuchun Deng, Peijun Ding |
2021-01-05 |
| 10622145 |
Magnetic thin film deposition chamber and thin film deposition apparatus |
Yujie Yang, Tongwen Zhang, Wei Xia, Peijun Ding |
2020-04-14 |
| 10381202 |
Magnetron and magnetron sputtering device |
Yujie Yang, Qiang Li, Guoqing Qiu, Zhimin BAI, Peijun Ding +1 more |
2019-08-13 |
| 10287686 |
Hot plate and substrate processing equipment using the same |
Mengxin Zhao, Xu Liu, Peijun Ding, Wei Xia, Lihui Wen |
2019-05-14 |
| 8747556 |
Apparatuses and methods for atomic layer deposition |
Hyman Lam, Bo Zheng, Hua Ai, Michael S. Jackson, Xiaoxiong Yuan +2 more |
2014-06-10 |
| 8293015 |
Apparatuses and methods for atomic layer deposition |
Hyman Lam, Bo Zheng, Hua Ai, Michael S. Jackson, Xiaoxiong Yuan +2 more |
2012-10-23 |
| 7884032 |
Thin film deposition |
Mengqi Ye, Peijun Ding, Zhendong Liu |
2011-02-08 |
| 7006888 |
Semiconductor wafer preheating |
Kenny King-Tai Ngan, Zheng Xu |
2006-02-28 |
| 6913680 |
Method of application of electrical biasing to enhance metal deposition |
Bo Zheng, Girish Dixit, Fusen Chen |
2005-07-05 |
| 6672864 |
Method and apparatus for processing substrates in a system having high and low pressure areas |
Zheng Xu, Kenny King-Tai Ngan |
2004-01-06 |
| 6610189 |
Method and associated apparatus to mechanically enhance the deposition of a metal film within a feature |
Bo Zheng, Girish Dixit, Fusen Chen |
2003-08-26 |
| 6303994 |
Method and apparatus for reducing the first wafer effect |
Gongda Yao |
2001-10-16 |
| 6299689 |
Reflow chamber and process |
Steve Lai, Gongda Yao, Peijun Ding |
2001-10-09 |
| 6139698 |
Method and apparatus for reducing the first wafer effect |
Gongda Yao |
2000-10-31 |
| 6077404 |
Reflow chamber and process |
Steve Lai, Gongda Yao, Peijun Ding |
2000-06-20 |
| 6077402 |
Central coil design for ionized metal plasma deposition |
Liubo Hong, Gongda Yao, Zheng Xu |
2000-06-20 |
| 5976695 |
Thermally sprayable powder materials having an alloyed metal phase and a solid lubricant ceramic phase and abradable seal assemblies manufactured therefrom |
Karel Hajmrle |
1999-11-02 |
| 5879523 |
Ceramic coated metallic insulator particularly useful in a plasma sputter reactor |
Peijun Ding |
1999-03-09 |
