| 6893541 |
Multi-step process for depositing copper seed layer in a via |
Tony P. Chiang, Yu D. Cong, Peijun Ding, Jianming Fu, Howard H. Tang |
2005-05-17 |
| 6582569 |
Process for sputtering copper in a self ionized plasma |
Tony P. Chiang, Yu D. Cong, Peijun Ding, Jianming Fu, Howard H. Tang |
2003-06-24 |
| 6433314 |
Direct temperature control for a component of a substrate processing chamber |
Tushar Mandrekar, Nitin Khurana |
2002-08-13 |
| 6413383 |
Method for igniting a plasma in a sputter reactor |
Tony P. Chiang, Yu D. Cong, Peijun Ding, Jianming Fu, Howard H. Tang |
2002-07-02 |
| 6398929 |
Plasma reactor and shields generating self-ionized plasma for sputtering |
Tony P. Chiang, Yu D. Cong, Peijun Ding, Jianming Fu, Howard H. Tang |
2002-06-04 |
| 6375753 |
Method and apparatus for removing processing liquid from a processing liquid delivery line |
Tushar Mandrekar, Michael S. Jackson |
2002-04-23 |
| 6345642 |
Method and apparatus for removing processing liquid from a processing liquid path |
Ted G. Yoshidome, Tushar Mandrekar, Nitin Khurana |
2002-02-12 |
| 6305392 |
Method and apparatus for removing processing liquid from a processing liquid delivery line |
Tushar Mandrekar, Michael S. Jackson |
2001-10-23 |
| 6297147 |
Plasma treatment for ex-situ contact fill |
Lisa Yang, Roderick C. Mosely |
2001-10-02 |
| 6117245 |
Method and apparatus for controlling cooling and heating fluids for a gas distribution plate |
Tushar Mandrekar, Nitin Khurana |
2000-09-12 |
