Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6893541 | Multi-step process for depositing copper seed layer in a via | Tony P. Chiang, Peijun Ding, Jianming Fu, Howard H. Tang, Anish Tolia | 2005-05-17 |
| 6582569 | Process for sputtering copper in a self ionized plasma | Tony P. Chiang, Peijun Ding, Jianming Fu, Howard H. Tang, Anish Tolia | 2003-06-24 |
| 6413383 | Method for igniting a plasma in a sputter reactor | Tony P. Chiang, Peijun Ding, Jianming Fu, Howard H. Tang, Anish Tolia | 2002-07-02 |
| 6402806 | Method for unreacted precursor conversion and effluent removal | John V. Schmitt, Ling Chen, George Michael Bleyle, Alfred Mak, Mei Chang | 2002-06-11 |
| 6398929 | Plasma reactor and shields generating self-ionized plasma for sputtering | Tony P. Chiang, Peijun Ding, Jianming Fu, Howard H. Tang, Anish Tolia | 2002-06-04 |
| 6099649 | Chemical vapor deposition hot-trap for unreacted precursor conversion and effluent removal | John V. Schmitt, Ling Chen, George Michael Bleyle, Alfred Mak, Mei Chang | 2000-08-08 |