| 6893541 |
Multi-step process for depositing copper seed layer in a via |
Tony P. Chiang, Peijun Ding, Jianming Fu, Howard H. Tang, Anish Tolia |
2005-05-17 |
| 6582569 |
Process for sputtering copper in a self ionized plasma |
Tony P. Chiang, Peijun Ding, Jianming Fu, Howard H. Tang, Anish Tolia |
2003-06-24 |
| 6413383 |
Method for igniting a plasma in a sputter reactor |
Tony P. Chiang, Peijun Ding, Jianming Fu, Howard H. Tang, Anish Tolia |
2002-07-02 |
| 6402806 |
Method for unreacted precursor conversion and effluent removal |
John V. Schmitt, Ling Chen, George Michael Bleyle, Alfred Mak, Mei Chang |
2002-06-11 |
| 6398929 |
Plasma reactor and shields generating self-ionized plasma for sputtering |
Tony P. Chiang, Peijun Ding, Jianming Fu, Howard H. Tang, Anish Tolia |
2002-06-04 |
| 6099649 |
Chemical vapor deposition hot-trap for unreacted precursor conversion and effluent removal |
John V. Schmitt, Ling Chen, George Michael Bleyle, Alfred Mak, Mei Chang |
2000-08-08 |
