Patents per Year
Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 7485556 | Forming metal silicide on silicon-containing features of a substrate | Jeong Soo Byun, Jianxin Lei, Hien Minh Le | 2009-02-03 | $43,350,000 |
| 7321140 | Magnetron sputtered metallization of a nickel silicon alloy, especially useful as solder bump barrier | Yanping Li, Jriyan Jerry Chen | 2008-01-22 | $43,057,000 |
| 6426282 | Method of forming solder bumps on a semiconductor wafer | Dinesh Saigal, Shankarram Athreya, Kenny King-Tai Ngan | 2002-07-30 | $151,460,000 |
| 6297147 | Plasma treatment for ex-situ contact fill | Anish Tolia, Roderick C. Mosely | 2001-10-02 | $37,523,000 |
| D436815 | Pivotal coupling for a shear device | — | 2001-01-30 | |
| 6149784 | Sputtering chamber shield promoting reliable plasma ignition | Jingang Su, Nelson Yee, John C. Forster, Kenny King-Tai Ngan | 2000-11-21 | $50,110,000 |