Issued Patents All Time
Showing 25 most recent of 140 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424481 | Modular substrate support assembly | Arvinder Manmohan Singh Chadha, Glen T. Mori, Christopher Laurent Beaudry | 2025-09-23 |
| 12400896 | Fabrication of substrate support devices using inorganic dielectric bonding | — | 2025-08-26 |
| 12347659 | Electrostatic chuck assembly for cryogenic applications | — | 2025-07-01 |
| 12331984 | Cryogenic micro-zone electrostatic chuck connector assembly | — | 2025-06-17 |
| 12334315 | Cooled substrate support assembly for radio frequency environments | Andreas Schmid, Andrew Antoine NOUJAIM, Stephen Prouty, Alvaro Garcia de Gorordo, Martin Perez-Guzman | 2025-06-17 |
| 12334385 | Tunable temperature controlled substrate support assembly | Steven E. Babayan, Konstantin Makhratchev, Zhiqiang Guo, Phillip R. Sommer, Dan Marohl | 2025-06-17 |
| 12243756 | Temperature controlled substrate support assembly | Konstantin Makhratchev, Masanori Ono, Zhiqiang Guo | 2025-03-04 |
| 12224198 | Electrostatic chuck with mesas | Ashutosh Agarwal | 2025-02-11 |
| 12205843 | Ground electrode formed in an electrostatic chuck for a plasma processing chamber | Michael R. Rice | 2025-01-21 |
| 12125734 | Vacuum seal for electrostatic chuck | — | 2024-10-22 |
| 12125728 | Substrate carrier | Fred Eric Ruhland, Sumit Subhash Patankar, Daniel Lee Diehl, Mingwei Zhu, Hiroyuki Takahama +1 more | 2024-10-22 |
| 12097665 | Porous plug bonding | — | 2024-09-24 |
| 12061103 | Packaging design for a flow sensor and methods of manufacturing thereof | Srikanth Krishnamurthy, Ming Xu, Ashley M. Okada, Ramachandra Murthy Gunturi | 2024-08-13 |
| 12057298 | Apparatus for fiber optic temperature probe in processing chambers | Marcus Blake Freitas, David Masayuki Ishikawa, Visweswaren Sivaramakrishnan | 2024-08-06 |
| 12033837 | Electrostatic chuck assembly for cryogenic applications | — | 2024-07-09 |
| 12020912 | Integrated electrode and ground plane for a substrate support | — | 2024-06-25 |
| 12009244 | Tunable temperature controlled substrate support assembly | Steven E. Babayan, Konstantin Makhratchev, Zhiqiang Guo, Phillip R. Sommer, Dan Marohl | 2024-06-11 |
| 11955361 | Electrostatic chuck with mesas | Ashutosh Agarwal | 2024-04-09 |
| 11948826 | High power electrostatic chuck design with radio frequency coupling | Jaeyong Cho, Haitao Wang, Kartik Ramaswamy, Chunlei Zhang | 2024-04-02 |
| 11881423 | Electrostatic chuck with metal bond | — | 2024-01-23 |
| 11818810 | Heater assembly with purge gap control and temperature uniformity for batch processing chambers | Dhritiman Subha Kashyap, Amit Rajendra Sherekar, Kartik Shah, Ashutosh Agarwal, Eric J. Hoffmann +1 more | 2023-11-14 |
| 11794441 | Bonding structure of e chuck to aluminum base configuration | Roger Alan Lindley | 2023-10-24 |
| 11784080 | High temperature micro-zone electrostatic chuck | — | 2023-10-10 |
| 11776794 | Electrostatic chuck assembly for cryogenic applications | — | 2023-10-03 |
| 11776822 | Wet cleaning of electrostatic chuck | Tuochuan Huang, Gang Peng, David W. Groechel, Shinnosuke Kawaguchi, David Benjaminson | 2023-10-03 |