Issued Patents All Time
Showing 26–33 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8262871 | Plating method and apparatus with multiple internally irrigated chambers | Steven T. Mayer, Shantinath Ghongadi, Kousik Ganesan, Zhian He | 2012-09-11 |
| 8257781 | Electroless plating-liquid system | Eric G. Webb, Steven T. Mayer, David Mark Dinneen, Edmund Minshall, Christopher M. Bartlett +6 more | 2012-09-04 |
| 8172646 | Magnetically actuated chuck for edge bevel removal | Aaron Louis LaBrie, Kousik Ganesan | 2012-05-08 |
| 7690324 | Small-volume electroless plating cell | Steven T. Mayer, Daniel Mark Dinneen, Edmund Minshall, Christopher M. Bartlett, Eric G. Webb +6 more | 2010-04-06 |
| 6967174 | Wafer chuck for use in edge bevel removal of copper from silicon wafers | Steven T. Mayer, Steve Taatjes, Andy McCutcheon, Jim Schall | 2005-11-22 |
| 6713122 | Methods and apparatus for airflow and heat management in electroless plating | Steven T. Mayer, John B. Alexy | 2004-03-30 |
| 6193859 | Electric potential shaping apparatus for holding a semiconductor wafer during electroplating | Robert J. Contolini, Jonathan D. Reid, Evan E. Patton, Steve Taatjes, John O. Dukovic | 2001-02-27 |
| 6159354 | Electric potential shaping method for electroplating | Robert J. Contolini, Jonathan D. Reid, Evan E. Patton, Steve Taatjes, John O. Dukovic | 2000-12-12 |