Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6967174 | Wafer chuck for use in edge bevel removal of copper from silicon wafers | Steven T. Mayer, Andy McCutcheon, Jim Schall, Jingbin Feng | 2005-11-22 |
| 6537416 | Wafer chuck for use in edge bevel removal of copper from silicon wafers | Steven T. Mayer, Andy McCutcheon, Jim Schall, Jinbin Feng | 2003-03-25 |
| 6402923 | Method and apparatus for uniform electroplating of integrated circuits using a variable field shaping element | Steven T. Mayer, Richard Hill, Alain Harrus, Evan E. Patton, Robert J. Contolini +1 more | 2002-06-11 |
| 6193859 | Electric potential shaping apparatus for holding a semiconductor wafer during electroplating | Robert J. Contolini, Jonathan D. Reid, Evan E. Patton, Jingbin Feng, John O. Dukovic | 2001-02-27 |
| 6179983 | Method and apparatus for treating surface including virtual anode | Jonathan D. Reid | 2001-01-30 |
| 6159354 | Electric potential shaping method for electroplating | Robert J. Contolini, Jonathan D. Reid, Evan E. Patton, Jingbin Feng, John O. Dukovic | 2000-12-12 |