Issued Patents All Time
Showing 25 most recent of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7211175 | Method and apparatus for potential controlled electroplating of fine patterns on semiconductor wafers | Steven T. Mayer, Jonathan D. Reid | 2007-05-01 |
| 7070686 | Dynamically variable field shaping element | Andrew J. McCutcheon, Steven T. Mayer | 2006-07-04 |
| 6716334 | Electroplating process chamber and method with pre-wetting and rinsing capability | Jonathan D. Reid, Steven W. Taatjes, Evan E. Patton | 2004-04-06 |
| 6709565 | Method and apparatus for uniform electropolishing of damascene ic structures by selective agitation | Steven T. Mayer, Eliot K. Broadbent, John Drewery | 2004-03-23 |
| 6569299 | Membrane partition system for plating of wafers | Jonathan D. Reid, John O. Dukovic | 2003-05-27 |
| 6562204 | Apparatus for potential controlled electroplating of fine patterns on semiconductor wafers | Steven T. Mayer, Jonathan D. Reid | 2003-05-13 |
| 6551483 | Method for potential controlled electroplating of fine patterns on semiconductor wafers | Steven T. Mayer, Jonathan D. Reid | 2003-04-22 |
| 6514393 | Adjustable flange for plating and electropolishing thickness profile control | Andrew J. McCutcheon | 2003-02-04 |
| 6402923 | Method and apparatus for uniform electroplating of integrated circuits using a variable field shaping element | Steven T. Mayer, Richard Hill, Alain Harrus, Evan E. Patton, Steve Taatjes +1 more | 2002-06-11 |
| 6315883 | Electroplanarization of large and small damascene features using diffusion barriers and electropolishing | Steven T. Mayer | 2001-11-13 |
| 6261961 | Adhesion layer for etching of tracks in nuclear trackable materials | Jeffrey D. Morse | 2001-07-17 |
| 6214193 | Electroplating process including pre-wetting and rinsing | Jonathan D. Reid, Steven W. Taatjes, Evan E. Patton | 2001-04-10 |
| 6193870 | Use of a hard mask for formation of gate and dielectric via nanofilament field emission devices | Jeffrey D. Morse | 2001-02-27 |
| 6193859 | Electric potential shaping apparatus for holding a semiconductor wafer during electroplating | Jonathan D. Reid, Evan E. Patton, Jingbin Feng, Steve Taatjes, John O. Dukovic | 2001-02-27 |
| 6162344 | Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer | Jonathan D. Reid, Edward C. Opocensky, Evan E. Patton, Eliot K. Broadbent | 2000-12-19 |
| 6159354 | Electric potential shaping method for electroplating | Jonathan D. Reid, Evan E. Patton, Jingbin Feng, Steve Taatjes, John O. Dukovic | 2000-12-12 |
| 6139716 | Submicron patterned metal hole etching | Anthony M. McCarthy, Vladimir Liberman, Jeffrey D. Morse | 2000-10-31 |
| 6126798 | Electroplating anode including membrane partition system and method of preventing passivation of same | Jonathan D. Reid, John O. Dukovic | 2000-10-03 |
| 6110346 | Method of electroplating semicoductor wafer using variable currents and mass transfer to obtain uniform plated layer | Jonathan D. Reid, Edward C. Opocensky, Evan E. Patton, Eliot K. Broadbent | 2000-08-29 |
| 6099702 | Electroplating chamber with rotatable wafer holder and pre-wetting and rinsing capability | Jonathan D. Reid, Steven W. Taatjes, Evan E. Patton | 2000-08-08 |
| 6074544 | Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer | Jonathan D. Reid, Edward C. Opocensky, Evan E. Patton, Eliot K. Broadbent | 2000-06-13 |
| 6051493 | Process for protecting bonded components from plating shorts | Lisa A. Tarte, Wayne L. Bonde, Paul G. Carey, Anthony M. McCarthy | 2000-04-18 |
| 6045678 | Formation of nanofilament field emission devices | Jeffrey D. Morse, Ronald G. Musket, Anthony F. Bernhardt | 2000-04-04 |
| 6033583 | Vapor etching of nuclear tracks in dielectric materials | Ronald G. Musket, John D. Porter, James M. Yoshiyama | 2000-03-07 |
| 5658832 | Method of forming a spacer for field emission flat panel displays | Anthony F. Bernhardt | 1997-08-19 |