EB

Eliot K. Broadbent

NS Novellus Systems: 25 patents #20 of 780Top 3%
SI Signetics: 3 patents #5 of 93Top 6%
NS National Semiconductor: 2 patents #867 of 2,238Top 40%
ND North American Philips Corp., Signetics Division: 2 patents #4 of 43Top 10%
SI Siliconix Incorporated: 1 patents #74 of 125Top 60%
📍 San Jose, CA: #1,864 of 32,062 inventorsTop 6%
🗺 California: #15,733 of 386,348 inventorsTop 5%
Overall (All Time): #113,941 of 4,157,543Top 3%
32
Patents All Time

Issued Patents All Time

Showing 1–25 of 32 patents

Patent #TitleCo-InventorsDate
8883640 Sequential station tool for wet processing of semiconductor wafers Evan E. Patton, Theodore Cacouris, Steven T. Mayer 2014-11-11
8450210 Sequential station tool for wet processing of semiconductor wafers Evan E. Patton, Theodore Cacouris, Steven T. Mayer 2013-05-28
8026174 Sequential station tool for wet processing of semiconductor wafers Evan E. Patton, Theodore Cacouris, Steven T. Mayer 2011-09-27
7189647 Sequential station tool for wet processing of semiconductor wafers Evan E. Patton, Theodore Cacouris, Steven T. Mayer 2007-03-13
6709565 Method and apparatus for uniform electropolishing of damascene ic structures by selective agitation Steven T. Mayer, Robert J. Contolini, John Drewery 2004-03-23
6554914 Passivation of copper in dual damascene metalization Robert T. Rozbicki, Ronald A. Powell, Erich R. Klawuhn, Michal Danek, Karl B. Levy +2 more 2003-04-29
6225744 Plasma process apparatus for integrated circuit fabrication having dome-shaped induction coil Jeffrey Tobin, Jeffrey C. Benzing, J. Kirkwood H. Rough 2001-05-01
6162344 Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer Jonathan D. Reid, Robert J. Contolini, Edward C. Opocensky, Evan E. Patton 2000-12-19
6110346 Method of electroplating semicoductor wafer using variable currents and mass transfer to obtain uniform plated layer Jonathan D. Reid, Robert J. Contolini, Edward C. Opocensky, Evan E. Patton 2000-08-29
6074544 Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer Jonathan D. Reid, Robert J. Contolini, Edward C. Opocensky, Evan E. Patton 2000-06-13
6027631 Electroplating system with shields for varying thickness profile of deposited layer 2000-02-22
5925411 Gas-based substrate deposition protection Everhardus P. van de Ven, Jeffrey C. Benzing, Barry Chin, Christopher W. Burkhart 1999-07-20
5882417 Apparatus for preventing deposition on frontside peripheral region and edge of wafer in chemical vapor deposition apparatus Everhardus P. van de Ven, Jeffrey C. Benzing, Barry Chin, Christopher W. Burkhart, Lawrence C. Lane +1 more 1999-03-16
5843233 Exclusion guard and gas-based substrate protection for chemical vapor deposition apparatus Everhardus P. van de Ven, Jeffrey C. Benzing, Barry Chin, Christopher W. Burkhart, Lawrence C. Lane +1 more 1998-12-01
5769951 Exclusion guard and gas-based substrate protection for chemical vapor deposition apparatus Everhardus P. van de Ven, Jeffrey C. Benzing, Barry Chin, Christopher W. Burkhart, Lawrence C. Lane 1998-06-23
5679405 Method for preventing substrate backside deposition during a chemical vapor deposition operation Michael E. Thomas, Everhardus P. van de Van 1997-10-21
5620525 Apparatus for supporting a substrate and introducing gas flow doximate to an edge of the substrate Everhardus P. van de Ven, Jeffrey C. Benzing, Barry Chin, Christopher W. Burkhart 1997-04-15
5605599 Method of generating plasma having high ion density for substrate processing operation Jeffrey C. Benzing, J. Kirkwood H. Rough 1997-02-25
5578532 Wafer surface protection in a gas deposition process Everhardus P. van de Ven, Jeffrey C. Benzing, Barry Chin, Christopher W. Burkhart 1996-11-26
5405480 Induction plasma source Jeffrey C. Benzing, J. Kirkwood H. Rough 1995-04-11
5374594 Gas-based backside protection during substrate processing Everhardus P. van de Ven, Jeffrey C. Benzing, Barry Chin, Christopher W. Burkhart 1994-12-20
5346578 Induction plasma source Jeffrey C. Benzing, Kirkwood Rough 1994-09-13
5238499 Gas-based substrate protection during processing Everhardus P. van de Ven, Jeffrey C. Benzing, Barry Chin, Christopher W. Burkhart 1993-08-24
5230741 Gas-based backside protection during substrate processing Everhardus P. van de Ven, Jeffrey C. Benzing, Barry Chin, Christopher W. Burkhart 1993-07-27
5188717 Sweeping method and magnet track apparatus for magnetron sputtering Kenneth C. Miller 1993-02-23