Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Process for electroplating metals into microscopic recessed features

Process for electroplating metals into microscopic recessed features

US Patent 8048280 · Granted Nov 1, 2011

Estimated economic value: $9,147,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Rain guard system mountable to a vehicle2025
Byproduct removal from electroplating solutions2025
TSV process window and fill performance enhancement by long pulsing and ramping2025
Gold through silicon mask plating2025
Wafer shielding for prevention of lipseal plate-out2025
Systems and methods for utilizing intrinsic current noise to measure interface i2024
Copper electrofill on non-copper liner layers2024
Electromagnetic interference reduction in extended reality environments2024
Electro-oxidative metal removal in through mask interconnect fabrication2023
Electroplating apparatus for tailored uniformity profile2023
Cleaning electroplating substrate holders using reverse current deplating2023
Removal of electroplating bath additives2022