EP

Evan E. Patton

NS Novellus Systems: 34 patents #10 of 780Top 2%
Tektronix: 3 patents #378 of 1,698Top 25%
IBM: 3 patents #26,272 of 70,183Top 40%
Lam Research: 1 patents #1,364 of 2,128Top 65%
📍 Portland, OR: #473 of 9,213 inventorsTop 6%
🗺 Oregon: #968 of 28,073 inventorsTop 4%
Overall (All Time): #82,718 of 4,157,543Top 2%
39
Patents All Time

Issued Patents All Time

Showing 26–39 of 39 patents

Patent #TitleCo-InventorsDate
6343793 Dual channel rotary union Wayne Fetters 2002-02-05
6309981 Edge bevel removal of copper from silicon wafers Steven T. Mayer, Carl J. Russo 2001-10-30
6214193 Electroplating process including pre-wetting and rinsing Jonathan D. Reid, Steven W. Taatjes, Robert J. Contolini 2001-04-10
6193859 Electric potential shaping apparatus for holding a semiconductor wafer during electroplating Robert J. Contolini, Jonathan D. Reid, Jingbin Feng, Steve Taatjes, John O. Dukovic 2001-02-27
6162344 Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer Jonathan D. Reid, Robert J. Contolini, Edward C. Opocensky, Eliot K. Broadbent 2000-12-19
6159354 Electric potential shaping method for electroplating Robert J. Contolini, Jonathan D. Reid, Jingbin Feng, Steve Taatjes, John O. Dukovic 2000-12-12
6156167 Clamshell apparatus for electrochemically treating semiconductor wafers Wayne Fetters 2000-12-05
6139712 Method of depositing metal layer Wayne Fetters 2000-10-31
6110346 Method of electroplating semicoductor wafer using variable currents and mass transfer to obtain uniform plated layer Jonathan D. Reid, Robert J. Contolini, Edward C. Opocensky, Eliot K. Broadbent 2000-08-29
6099702 Electroplating chamber with rotatable wafer holder and pre-wetting and rinsing capability Jonathan D. Reid, Steven W. Taatjes, Robert J. Contolini 2000-08-08
6074544 Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer Jonathan D. Reid, Robert J. Contolini, Edward C. Opocensky, Eliot K. Broadbent 2000-06-13
5029117 Method and apparatus for active pyrometry 1991-07-02
4994400 Method of fabricating a semiconductor device using a tri-layer structure and conductive sidewalls Tadanori Yamaguchi, Yeou-Chong S. Yu, Carol A. Hacherl 1991-02-19
4876214 Method for fabricating an isolation region in a semiconductor substrate Tadanori Yamaguchi, Eric Lane, Simon Yeou-Chong Yu 1989-10-24