| 7829427 |
Method of fabricating a high Q factor integrated circuit inductor |
Daniel C. Edelstein, John M. Cotte, Hariklia Deligianni, John Harold Magerlein, Kevin S. Petrarca +2 more |
2010-11-09 |
| 7678258 |
Void-free damascene copper deposition process and means of monitoring thereof |
Dean S. Chung, Hariklia Deligianni, James E. Fluegel, Keith Kwietniak, Peter S. Locke +4 more |
2010-03-16 |
| 7638406 |
Method of fabricating a high Q factor integrated circuit inductor |
Daniel C. Edelstein, John M. Cotte, Hariklia Deligianni, John Harold Magerlein, Kevin S. Petrarca +2 more |
2009-12-29 |
| 7581314 |
Method of forming noble metal contacts |
Hariklia Deligianni, L. Paivikki Buchwalter, John M. Cotte, Christopher V. Jahnes, Mahadevaiyer Krishnan +5 more |
2009-09-01 |
| 7553400 |
Plating apparatus and plating method |
Mizuki Nagai, Hiroyuki Kanda, Keiichi Kurashina, Satoru Yamamoto, Ryoichi Kimizuka +4 more |
2009-06-30 |
| 7227265 |
Electroplated copper interconnection structure, process for making and electroplating bath |
Steven H. Boettcher, Dean S. Chung, Hariklia Deligianni, James E. Fluegel, Wilma Jean Horkans +6 more |
2007-06-05 |
| 7212091 |
Micro-electro-mechanical RF switch |
L. Paivikki Buchwalter, Hariklia Deligianni, Robert A. Groves, Christopher V. Jahnes, Jennifer Lund +4 more |
2007-05-01 |
| 7202764 |
Noble metal contacts for micro-electromechanical switches |
Hariklia Deligianni, L. Paivikki Buchwalter, John M. Cotte, Christopher V. Jahnes, Mahadevaiyer Krishnan +5 more |
2007-04-10 |
| 7190079 |
Selective capping of copper wiring |
Shyng-Tsong Chen, John M. Cotte, Hariklia Deligianni, Mahadevaiyer Krishnan, Wei-Tsu Tseng +1 more |
2007-03-13 |
| 7112851 |
Field effect transistor with electroplated metal gate |
Cyril Cabral, Jr., Hariklia Deligianni, Philippe M. Vereecken, Emanuel I. Cooper, Katherine L. Saenger |
2006-09-26 |
| 7068138 |
High Q factor integrated circuit inductor |
Daniel C. Edelstein, John M. Cotte, Hariklia Deligianni, John Harold Magerlein, Kevin S. Petrarca +2 more |
2006-06-27 |
| 7060624 |
Deep filled vias |
Emanuel I. Cooper, Timothy J. Dalton, Hariklia Deligianni, Daniel Guidotti, Keith Kwietniak +2 more |
2006-06-13 |
| 7008871 |
Selective capping of copper wiring |
Shyng-Tsong Chen, John M. Cotte, Hariklia Deligianni, Mahadevaiyer Krishnan, Wei-Tsu Tseng +1 more |
2006-03-07 |
| 6992389 |
Barrier for interconnect and method |
Tien-Jen Cheng, Emanuel I. Cooper, David E. Eichstadt, Jonathan H. Griffith, Randolph F. Knarr +2 more |
2006-01-31 |
| 6979393 |
Method for plating copper conductors and devices formed |
Kenneth P. Rodbell, Cyril Cabral, Jr., Lynne M. Gignac, Cyprian Emeka Uzoh, Peter S. Locke |
2005-12-27 |
| 6974531 |
Method for electroplating on resistive substrates |
Hariklia Deligianni, Wilma Jean Horkans, Keith Kwietniak, Michael Lane, Sandra G. Malhotra +4 more |
2005-12-13 |
| 6967131 |
Field effect transistor with electroplated metal gate |
Katherine L. Saenger, Cyril Cabral, Jr., Emanuel I. Cooper, Hariklia Deligianni, Philippe M. Vereecken |
2005-11-22 |
| 6946716 |
Electroplated interconnection structures on integrated circuit chips |
Harikilia Deligianni, John O. Dukovic, Daniel C. Edelstein, Wilma Jean Horkans, Chao-Kun Hu +4 more |
2005-09-20 |
| 6911229 |
Structure comprising an interlayer of palladium and/or platinum and method for fabrication thereof |
Steven H. Boettcher, Fenton R. McFeely, Milan Paunovic |
2005-06-28 |
| 6876282 |
Micro-electro-mechanical RF switch |
L. Paivikki Buchwalter, Hariklia Deligianni, Robert A. Groves, Christopher V. Jahnes, Jennifer Lund +4 more |
2005-04-05 |
| 6776885 |
Integrated plating and planarization apparatus having a variable-diameter counterelectrode |
Laertis Economikos, Hariklia Deligianni, John M. Cotte |
2004-08-17 |
| 6709562 |
Method of making electroplated interconnection structures on integrated circuit chips |
Hariklia Deligianni, John O. Dukovic, Daniel C. Edelstein, Wilma Jean Horkans, Chao-Kun Hu +4 more |
2004-03-23 |
| 6639488 |
MEMS RF switch with low actuation voltage |
Hariklia Deligianni, Robert A. Groves, Christopher V. Jahnes, Jennifer Lund, John M. Cotte +3 more |
2003-10-28 |
| 6589874 |
Method for forming electromigration-resistant structures by doping |
Cyril Cabral, Jr., Christopher C. Parks, Kenneth P. Rodbell, Roger Y. Tsai |
2003-07-08 |
| 6570255 |
Method for forming interconnects on semiconductor substrates and structures formed |
Cyril Cabral, Jr., John M. Cotte, Lynne M. Gignac, Wilma Jean Horkans, Kenneth P. Rodbell |
2003-05-27 |
