Issued Patents All Time
Showing 26–50 of 52 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6471845 | Method of controlling chemical bath composition in a manufacturing environment | John O. Dukovic, William E. Corbin, Jr., Erick G. Walton, Peter S. Locke, James E. Fluegel +2 more | 2002-10-29 |
| 6429523 | Method for forming interconnects on semiconductor substrates and structures formed | Cyril Cabral, Jr., John M. Cotte, Lynne M. Gignac, Wilma Jean Horkans, Kenneth P. Rodbell | 2002-08-06 |
| 6416812 | Method for depositing copper onto a barrier layer | Steven H. Boettcher, Fenton R. McFeely, Milan Paunovic | 2002-07-09 |
| 6406608 | Apparatus to monitor and add plating solution to plating baths and controlling quality of deposited metal | Cyprian Emeka Uzoh, Wilma Jean Horkans | 2002-06-18 |
| 6395164 | Copper seed layer repair technique using electroless touch-up | James E. Fluegel, John G. Gaudiello, Ronald D. Goldblatt, Sandra G. Malhotra, Milan Paunovic | 2002-05-28 |
| 6391773 | Method and materials for through-mask electroplating and selective base removal | Cyril Cabral, Jr., Roy A. Carruthers, Alfred Grill, Katherine L. Saenger | 2002-05-21 |
| 6344129 | Method for plating copper conductors and devices formed | Kenneth P. Rodbell, Cyril Cabral, Jr., Lynne M. Gignac, Cyprian Emeka Uzoh, Peter S. Locke | 2002-02-05 |
| 6331237 | Method of improving contact reliability for electroplating | W. Jean Horkans, Keith Kwietniak, Peter S. Locke, Cyprian Emeka Uzoh | 2001-12-18 |
| 6323127 | Capacitor formed with Pt electrodes having a 3D cup-like shape with roughened inner and outer surfaces | Gregory Costrini, David E. Kotecki, Katherine L. Saenger | 2001-11-27 |
| 6268291 | Method for forming electromigration-resistant structures by doping | Cyril Cabral, Jr., Christopher C. Parks, Kenneth P. Rodbell, Roger Y. Tsai | 2001-07-31 |
| 6251251 | Anode design for semiconductor deposition | Cyprian Emeka Uzoh, John O. Dukovic, Robert P. Westerfield, Jr. | 2001-06-26 |
| 6224690 | Flip-Chip interconnections using lead-free solders | Madhav Datta, Hariklia Deligianni, Wilma Jean Horkans, Sung Kwon Kang, Keith Kwietniak +4 more | 2001-05-01 |
| 6188120 | Method and materials for through-mask electroplating and selective base removal | Cyril Cabral, Jr., Roy A. Carruthers, Alfred Grill, Katherine L. Saenger | 2001-02-13 |
| 6113769 | Apparatus to monitor and add plating solution of plating baths and controlling quality of deposited metal | Cyprian Emeka Uzoh, Wilma Jean Horkans | 2000-09-05 |
| 6090710 | Method of making copper alloys for chip and package interconnections | Hariklia Deligianni, James M. E. Harper, Chao-Kun Hu, Dale J. Pearson, Scott K. Reynolds +2 more | 2000-07-18 |
| 6063506 | Copper alloys for chip and package interconnections | Hariklia Deligianni, James M. E. Harper, Chao-Kun Hu, Dale J. Pearson, Scott K. Reynolds +2 more | 2000-05-16 |
| 5998250 | Compound electrode stack capacitor | David E. Kotecki, Katherine L. Saenger | 1999-12-07 |
| 5937320 | Barrier layers for electroplated SnPb eutectic solder joints | Madhav Datta, Wilma Jean Horkans, Sung Kwon Kang, Keith Kwietniak | 1999-08-10 |
| 5825609 | Compound electrode stack capacitor | David E. Kotecki, Katherine L. Saenger | 1998-10-20 |
| 5789320 | Plating of noble metal electrodes for DRAM and FRAM | James H. Comfort, Alfred Grill, David E. Kotecki, Vishnubhai V. Patel, Katherine L. Saenger +1 more | 1998-08-04 |
| 5582927 | High magnetic moment materials and process for fabrication of thin film heads | Jei-Wei Chang, Wilma Jean Horkans, Judith D. Olsen, Bojan Petek, Lubomyr T. Romankiw | 1996-12-10 |
| 5522975 | Electroplating workpiece fixture | Kirk G. Berridge, John O. Dukovic, Helmut R. Poweleit, Jeffrey S. Richter, Lubomyr T. Romankiw +1 more | 1996-06-04 |
| 5516412 | Vertical paddle plating cell | Kirk G. Berridge, John O. Dukovic, Matteo Flotta, Jose Ordonez, Helmut R. Poweleit +5 more | 1996-05-14 |
| 5385661 | Acid electrolyte solution and process for the electrodeposition of copper-rich alloys exploiting the phenomenon of underpotential deposition | I-Chia H. Chang, Hariklia Deligianni, Wilma Jean Horkans | 1995-01-31 |
| 5352350 | Method for controlling chemical species concentration | John O. Dukovic, Lubomyr T. Romankiw | 1994-10-04 |