SB

Steven H. Boettcher

IBM: 9 patents #11,918 of 70,183Top 20%
DC Dongbu Electronics, Co.: 1 patents #160 of 281Top 60%
Infineon Technologies Ag: 1 patents #168 of 446Top 40%
📍 Fishkill, NY: #98 of 387 inventorsTop 30%
🗺 New York: #16,265 of 115,490 inventorsTop 15%
Overall (All Time): #534,981 of 4,157,543Top 15%
9
Patents All Time

Issued Patents All Time

Showing 1–9 of 9 patents

Patent #TitleCo-InventorsDate
12274966 Filter device having multiple changeable filter surfaces Madhana Sunder, Allan C. VanDeventer, Jay A. Bunt, Joyce E. Molinelli Acocella, Heather Nicole Polgrean +1 more 2025-04-15
7560692 Method of TEM sample preparation for electron holography for semiconductor devices Keith E. Barton, John G. Gaudiello, Leon J. Kimball, Yun-Yu Wang 2009-07-14
7227265 Electroplated copper interconnection structure, process for making and electroplating bath Panayotis Andricacos, Dean S. Chung, Hariklia Deligianni, James E. Fluegel, Wilma Jean Horkans +6 more 2007-06-05
7214935 Transmission electron microscopy sample preparation method for electron holography Thomas A. Bauer, Anthony G. Domenicucci, John G. Gaudiello, Leon J. Kimball, Jeffrey S. McMurray +1 more 2007-05-08
6911229 Structure comprising an interlayer of palladium and/or platinum and method for fabrication thereof Panayotis Andricacos, Fenton R. McFeely, Milan Paunovic 2005-06-28
6572982 Electromigration-resistant copper microstructure Cyprian Emeka Uzoh, Patrick W. DeHaven, Christopher C. Parks, Andrew H. Simon 2003-06-03
6416812 Method for depositing copper onto a barrier layer Panayotis Andricacos, Fenton R. McFeely, Milan Paunovic 2002-07-09
6383929 Copper vias in low-k technology Herbert L. Ho, Mark Hoinkis, Hyun Koo Lee, Yun-Yu Wang, Kwong Hon Wong 2002-05-07
6123825 Electromigration-resistant copper microstructure and process of making Cyprian Emeka Uzoh, Patrick W. DeHaven, Christopher C. Parks, Andrew H. Simon 2000-09-26