Issued Patents All Time
Showing 25 most recent of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483205 | Contact using multilayer liner | Donghun Kang, Neal A. Makela | 2019-11-19 |
| 9960118 | Contact using multilayer liner | Donghun Kang, Neal A. Makela | 2018-05-01 |
| 9589894 | Copper interconnect structure and its formation | Daniel C. Edelstein, Takeshi Nogami, Tsong-Lin Tai | 2017-03-07 |
| 8969197 | Copper interconnect structure and its formation | Daniel C. Edelstein, Takeshi Nogami, Tsong-Lin Tai | 2015-03-03 |
| 8901674 | Scaling of metal gate with aluminum containing metal layer for threshold voltage shift | Keith Kwong Hon Wong, Dechao Guo, Unoh Kwon, Yun-Yu Wang | 2014-12-02 |
| 8563446 | Technique to create a buried plate in embedded dynamic random access memory device | Ashima B. Chakravarti, Jacob B. Dadson, Paul Higgins, Babar A. Khan, John J. Moore +1 more | 2013-10-22 |
| 8431476 | Method to prevent surface decomposition of III-V compound semiconductors | Joel P. de Souza, Keith E. Fogel, Edward W. Kiewra, Steven J. Koester, Devendra K. Sadana +1 more | 2013-04-30 |
| 8415772 | Method to prevent surface decomposition of III-V compound semiconductors | Joel P. de Souza, Keith E. Fogel, Edward W. Kiewra, Steven J. Koester, Devendra K. Sadana +1 more | 2013-04-09 |
| 8273649 | Method to prevent surface decomposition of III-V compound semiconductors | Joel P. de Souza, Keith E. Fogel, Edward W. Kiewra, Steven J. Koester, Devendra K. Sadana +1 more | 2012-09-25 |
| 8236710 | Technique to create a buried plate in embedded dynamic random access memory device | Ashima B. Chakravarti, Jacob B. Dadson, Paul Higgins, Babar A. Khan, John J. Moore +1 more | 2012-08-07 |
| 7843067 | Method and structure of integrated rhodium contacts with copper interconnects | John M. Cotte, Balasubramanian Haran, Xiaoyan Shao, Eva E. Simonyi | 2010-11-30 |
| 7585765 | Formation of oxidation-resistant seed layer for interconnect applications | Chih-Chao Yang, Nancy R. Klymko, Keith Kwong Hon Wong | 2009-09-08 |
| 7276796 | Formation of oxidation-resistant seed layer for interconnect applications | Chih-Chao Yang, Nancy R. Klymko, Keith Kwong Hon Wong | 2007-10-02 |
| 7227265 | Electroplated copper interconnection structure, process for making and electroplating bath | Panayotis Andricacos, Steven H. Boettcher, Dean S. Chung, Hariklia Deligianni, James E. Fluegel +6 more | 2007-06-05 |
| 6890833 | Trench isolation employing a doped oxide trench fill | Michael P. Belyansky, Andreas Knorr, Oleg Gluschenkov | 2005-05-10 |
| 6815343 | Gas treatment of thin film structures with catalytic action | John David Baniecki, Robert Benjamin Laibowitz, Thomas M. Shaw | 2004-11-09 |
| 6797582 | Vertical thermal nitride mask (anti-collar) and processing thereof | Oleg Gluschenkov, Michael P. Chudzik, Rajarao Jammy, Kenneth T. Settlemyer, Jr., Radhika Srinivasan +1 more | 2004-09-28 |
| 6764551 | Process for removing dopant ions from a substrate | David Riggs, Rajarao Jammy, John I. Kim, Stephen M. Lucarini, George L. Mack | 2004-07-20 |
| 6589874 | Method for forming electromigration-resistant structures by doping | Panayotis Andricacos, Cyril Cabral, Jr., Kenneth P. Rodbell, Roger Y. Tsai | 2003-07-08 |
| 6572982 | Electromigration-resistant copper microstructure | Cyprian Emeka Uzoh, Steven H. Boettcher, Patrick W. DeHaven, Andrew H. Simon | 2003-06-03 |
| 6399434 | Doped structures containing diffusion barriers | Susan E. Chaloux, Johnathan E. Faltermeier, Ulrike Gruening, Rajarao Jammy, Paul C. Parries +2 more | 2002-06-04 |
| 6358855 | Clean method for recessed conductive barriers | Ravikumar Ramachandran, Nicolas Nagel | 2002-03-19 |
| 6268291 | Method for forming electromigration-resistant structures by doping | Panayotis Andricacos, Cyril Cabral, Jr., Kenneth P. Rodbell, Roger Y. Tsai | 2001-07-31 |
| 6265278 | Deep trench cell capacitor with inverting counter electrode | Johann Alsmeier, Jack A. Mandelman, James A. O'Neill, Paul C. Parries | 2001-07-24 |
| 6194736 | Quantum conductive recrystallization barrier layers | Susan E. Chaloux, Tze-Chiang Chen, Johnathan E. Faltermeier, Ulrike Gruening, Rajarao Jammy +4 more | 2001-02-27 |