Patent Leaderboard
USPTO Patent Rankings Data through Sept 30, 2025
PD

Patrick W. DeHaven

IBM: 23 patents #4,681 of 70,183Top 7%
HYHypernex: 2 patents #5 of 8Top 65%
Infineon Technologies Ag: 1 patents #4,439 of 7,486Top 60%
Poughkeepsie, NY: #170 of 1,613 inventorsTop 15%
New York: #5,468 of 115,490 inventorsTop 5%
Overall (All Time): #174,627 of 4,157,543Top 5%
24 Patents All Time

Issued Patents All Time

Showing 1–24 of 24 patents

Patent #TitleCo-InventorsDate
9224675 Automatic capacitance tuning for robust middle of the line contact and silicide applications Brett H. Engel, Domingo A. Ferrer, Arun Vijayakumar, Keith Kwong Hon Wong 2015-12-29
8574953 Low temperature melt-processing of organic-inorganic hybrid David R. Medeiros, David B. Mitzi 2013-11-05
8123997 Low temperature melt-processing of organic-inorganic hybrid David R. Medeiros, David B. Mitzi 2012-02-28
7951708 Copper interconnect structure with amorphous tantalum iridium diffusion barrier Daniel C. Edelstein, Philip L. Flaitz, Takeshi Nogami, Stephen M. Rossnagel, Chih-Chao Yang 2011-05-31
7456045 Low temperature melt-processing of organic-inorganic hybrid David R. Medeiros, David B. Mitzi 2008-11-25
7407875 Low resistance contact structure and fabrication thereof Keith Kwong Hon Wong, Sadanand V. Deshpande, Anita Madan 2008-08-05
7291516 Low temperature melt-processing of organic-inorganic hybrid David R. Medeiros, David B. Mitzi 2007-11-06
7223691 Method of forming low resistance and reliable via in inter-level dielectric interconnect Cyril Cabral, Jr., Lawrence A. Clevenger, Timothy J. Dalton, Chester T. Dziobkowski, Sunfei Fang +4 more 2007-05-29
7105360 Low temperature melt-processing of organic-inorganic hybrid David R. Medeiros, David B. Mitzi 2006-09-12
6916729 Salicide formation method Sunfei Fang, Keith Kwong Hon Wong, Paul D. Agnello, Christian Lavoie, Lawrence A. Clevenger +4 more 2005-07-12
6909772 Method and apparatus for thin film thickness mapping Krzysztof Kozaczek, David S. Kurtz, Paul R. Moran, Roger Isaac Martin, Kenneth P. Rodbell +1 more 2005-06-21
6792075 Method and apparatus for thin film thickness mapping Krzysztof Kozaczek, David S. Kurtz, Paul R. Moran, Roger Isaac Martin, Kenneth P. Rodbell +1 more 2004-09-14
6638374 Device produced by a process of controlling grain growth in metal films Charles C. Goldsmith, Jeffery L. Hurd, Suryanarayana Kaja, Michele S. Legere, Eric D. Perfecto 2003-10-28
6572982 Electromigration-resistant copper microstructure Cyprian Emeka Uzoh, Steven H. Boettcher, Christopher C. Parks, Andrew H. Simon 2003-06-03
6509265 Process for manufacturing a contact barrier Anthony G. Domenicucci, Lynne M. Gignac, Glen L. Miles, Prabhat Tiwari, Yun-Yu Wang +2 more 2003-01-21
6437440 Thin film metal barrier for electrical interconnections Cyril Cabral, Jr., Daniel C. Edelstein, David P. Klaus, James Manley Pollard, III, Carol L. Stanis +1 more 2002-08-20
6361627 Process of controlling grain growth in metal films Charles C. Goldsmith, Jeffery L. Hurd, Suryanarayana Kaja, Michele S. Legere, Eric D. Perfecto 2002-03-26
6333120 Method for controlling the texture and microstructure of plated copper and plated structure Peter S. Locke, Kenneth P. Rodbell, Cyprian Emeka Uzoh 2001-12-25
6291885 Thin metal barrier for electrical interconnections Cyril Cabral, Jr., Daniel C. Edelstein, David P. Klaus, James Manley Pollard, III, Carol L. Stanis +1 more 2001-09-18
6180521 Process for manufacturing a contact barrier Anthony G. Domenicucci, Lynne M. Gignac, Glen L. Miles, Prabhat Tiwari, Yun-Yu Wang +2 more 2001-01-30
6126761 Process of controlling grain growth in metal films Charles C. Goldsmith, Jeffrey Louis Hurd, Suryanarayana Kaja, Michele S. Legere, Eric D. Perfecto 2000-10-03
6123825 Electromigration-resistant copper microstructure and process of making Cyprian Emeka Uzoh, Steven H. Boettcher, Christopher C. Parks, Andrew H. Simon 2000-09-26
5943601 Process for fabricating a metallization structure Takamasa Usui, Kenneth P. Rodbell, Ronald G. Filippi, Chi-Hua Yang, Tomio Katata +1 more 1999-08-24
5171642 Multilayered intermetallic connection for semiconductor devices J. Daniel Mis, Kenneth P. Rodbell, Paul A. Totta, James F. White 1992-12-15