| 9224675 |
Automatic capacitance tuning for robust middle of the line contact and silicide applications |
Brett H. Engel, Domingo A. Ferrer, Arun Vijayakumar, Keith Kwong Hon Wong |
2015-12-29 |
$4,224,000 |
| 8574953 |
Low temperature melt-processing of organic-inorganic hybrid |
David R. Medeiros, David B. Mitzi |
2013-11-05 |
$5,290,000 |
| 8123997 |
Low temperature melt-processing of organic-inorganic hybrid |
David R. Medeiros, David B. Mitzi |
2012-02-28 |
$6,579,000 |
| 7951708 |
Copper interconnect structure with amorphous tantalum iridium diffusion barrier |
Daniel C. Edelstein, Philip L. Flaitz, Takeshi Nogami, Stephen M. Rossnagel, Chih-Chao Yang |
2011-05-31 |
$4,283,000 |
| 7456045 |
Low temperature melt-processing of organic-inorganic hybrid |
David R. Medeiros, David B. Mitzi |
2008-11-25 |
$6,627,000 |
| 7407875 |
Low resistance contact structure and fabrication thereof |
Keith Kwong Hon Wong, Sadanand V. Deshpande, Anita Madan |
2008-08-05 |
$7,485,000 |
| 7291516 |
Low temperature melt-processing of organic-inorganic hybrid |
David R. Medeiros, David B. Mitzi |
2007-11-06 |
$19,194,000 |
| 7223691 |
Method of forming low resistance and reliable via in inter-level dielectric interconnect |
Cyril Cabral, Jr., Lawrence A. Clevenger, Timothy J. Dalton, Chester T. Dziobkowski, Sunfei Fang +4 more |
2007-05-29 |
$6,985,000 |
| 7105360 |
Low temperature melt-processing of organic-inorganic hybrid |
David R. Medeiros, David B. Mitzi |
2006-09-12 |
$4,301,000 |
| 6916729 |
Salicide formation method |
Sunfei Fang, Keith Kwong Hon Wong, Paul D. Agnello, Christian Lavoie, Lawrence A. Clevenger +4 more |
2005-07-12 |
|
| 6909772 |
Method and apparatus for thin film thickness mapping |
Krzysztof Kozaczek, David S. Kurtz, Paul R. Moran, Roger Isaac Martin, Kenneth P. Rodbell +1 more |
2005-06-21 |
$6,933,000 |
| 6792075 |
Method and apparatus for thin film thickness mapping |
Krzysztof Kozaczek, David S. Kurtz, Paul R. Moran, Roger Isaac Martin, Kenneth P. Rodbell +1 more |
2004-09-14 |
|
| 6638374 |
Device produced by a process of controlling grain growth in metal films |
Charles C. Goldsmith, Jeffery L. Hurd, Suryanarayana Kaja, Michele S. Legere, Eric D. Perfecto |
2003-10-28 |
$14,845,000 |
| 6572982 |
Electromigration-resistant copper microstructure |
Cyprian Emeka Uzoh, Steven H. Boettcher, Christopher C. Parks, Andrew H. Simon |
2003-06-03 |
$9,669,000 |
| 6509265 |
Process for manufacturing a contact barrier |
Anthony G. Domenicucci, Lynne M. Gignac, Glen L. Miles, Prabhat Tiwari, Yun-Yu Wang +2 more |
2003-01-21 |
$15,954,000 |
| 6437440 |
Thin film metal barrier for electrical interconnections |
Cyril Cabral, Jr., Daniel C. Edelstein, David P. Klaus, James Manley Pollard, III, Carol L. Stanis +1 more |
2002-08-20 |
$9,830,000 |
| 6361627 |
Process of controlling grain growth in metal films |
Charles C. Goldsmith, Jeffery L. Hurd, Suryanarayana Kaja, Michele S. Legere, Eric D. Perfecto |
2002-03-26 |
$26,805,000 |
| 6333120 |
Method for controlling the texture and microstructure of plated copper and plated structure |
Peter S. Locke, Kenneth P. Rodbell, Cyprian Emeka Uzoh |
2001-12-25 |
|
| 6291885 |
Thin metal barrier for electrical interconnections |
Cyril Cabral, Jr., Daniel C. Edelstein, David P. Klaus, James Manley Pollard, III, Carol L. Stanis +1 more |
2001-09-18 |
$29,045,000 |
| 6180521 |
Process for manufacturing a contact barrier |
Anthony G. Domenicucci, Lynne M. Gignac, Glen L. Miles, Prabhat Tiwari, Yun-Yu Wang +2 more |
2001-01-30 |
$13,187,000 |
| 6126761 |
Process of controlling grain growth in metal films |
Charles C. Goldsmith, Jeffrey Louis Hurd, Suryanarayana Kaja, Michele S. Legere, Eric D. Perfecto |
2000-10-03 |
$31,821,000 |
| 6123825 |
Electromigration-resistant copper microstructure and process of making |
Cyprian Emeka Uzoh, Steven H. Boettcher, Christopher C. Parks, Andrew H. Simon |
2000-09-26 |
$64,342,000 |
| 5943601 |
Process for fabricating a metallization structure |
Takamasa Usui, Kenneth P. Rodbell, Ronald G. Filippi, Chi-Hua Yang, Tomio Katata +1 more |
1999-08-24 |
$33,463,000 |
| 5171642 |
Multilayered intermetallic connection for semiconductor devices |
J. Daniel Mis, Kenneth P. Rodbell, Paul A. Totta, James F. White |
1992-12-15 |
$8,444,000 |
