Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6255208 | Selective wafer-level testing and burn-in | William E. Bernier, Claude L. Bertin, Anilkumar C. Bhatt, Michael A. Gaynes, Erik L. Hedberg +5 more | 2001-07-03 |
| 6110819 | Interconnect structure using Al.sub.2 Cu for an integrated circuit chip | Evan G. Colgan, Kenneth P. Rodbell, James F. White | 2000-08-29 |
| 6068923 | Use of argon sputtering to modify surface properties by thin film deposition | Thomas Edward Dinan, Swami Mathad, Horatio S. Wildman | 2000-05-30 |
| 5956573 | Use of argon sputtering to modify surface properties by thin film deposition | Thomas Edward Dinan, Swami Mathad, Horatio S. Wildman | 1999-09-21 |
| 5925933 | Interconnect structure using Al.sub.2 -Cu for an integrated circuit chip | Evan G. Colgan, Kenneth P. Rodbell, James F. White | 1999-07-20 |
| 5629564 | Electroplated solder terminal | Henry A. Nye, III, Jeffrey F. Roeder, Ho-Ming Tong | 1997-05-13 |
| 5565707 | Interconnect structure using a Al.sub.2 Cu for an integrated circuit chip | Evan G. Colgan, Kenneth P. Rodbell, James F. White | 1996-10-15 |
| 5503286 | Electroplated solder terminal | Henry A. Nye, III, Jeffrey F. Roeder, Ho-Ming Tong | 1996-04-02 |
| 5251806 | Method of forming dual height solder interconnections | Birendra Agarwala, Aziz Mohammad Ahsan, Arthur Bross, Mark F. Chadurjian, Nicholas G. Koopman +8 more | 1993-10-12 |
| 5171642 | Multilayered intermetallic connection for semiconductor devices | Patrick W. DeHaven, J. Daniel Mis, Kenneth P. Rodbell, James F. White | 1992-12-15 |
| 5130779 | Solder mass having conductive encapsulating arrangement | Birendra Agarwala, Aziz Mohammad Ahsan, Arthur Bross, Mark F. Chadurjian, Nicholas G. Koopman +8 more | 1992-07-14 |
| 5071714 | Multilayered intermetallic connection for semiconductor devices | Kenneth P. Rodbell, James F. White | 1991-12-10 |
| 5008730 | Contact stud structure for semiconductor devices | Hung-Chang W. Huang | 1991-04-16 |
| 5008216 | Process for improved contact stud structure for semiconductor devices | Hung-Chang W. Huang | 1991-04-16 |
| 4839715 | Chip contacts without oxide discontinuities | Joseph J. Gajda, Kris V. Srikrishnan, Francis G. Trudeau | 1989-06-13 |
| 4824009 | Process for braze attachment of electronic package members | Raj N. Master, Marvin S. Pittler, Norman G. Ainslie, Paul H. Palmateer | 1989-04-25 |
| 4583488 | Variable axis rotary drive vacuum deposition system | William W. Brown, Wayne Curry, Gerhard P. Dahlke, Francis T. Lupul | 1986-04-22 |
| 4272561 | Hybrid process for SBD metallurgies | Laura Rothman, James F. White | 1981-06-09 |