Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5167913 | Method of forming an adherent layer of metallurgy on a ceramic substrate | John Acocella, Philip L. Flaitz, Raj N. Master, Chandrasekhar Narayan, Sarah H. Knickerbocker +2 more | 1992-12-01 |
| 4970570 | Use of tapered head pin design to improve the stress distribution in the braze joint | Birendra Agarwala, Da-Yuan Shih | 1990-11-13 |
| 4880684 | Sealing and stress relief layers and use thereof | David W. Boss, Timothy Carr, Derry J. Dubetsky, George M. Greenstein, Warren D. Grobman +6 more | 1989-11-14 |
| 4824009 | Process for braze attachment of electronic package members | Raj N. Master, Marvin S. Pittler, Paul A. Totta, Norman G. Ainslie | 1989-04-25 |
| 4764341 | Bonding of pure metal films to ceramics | Philip L. Flaitz, Raj N. Master, Srinivasa S. N. Reddy | 1988-08-16 |
| 4634638 | High melting point copper-gold-tin brazing alloy for chip carriers | Norman G. Ainslie, Joseph M. Harvilchuck, Mario J. Interrante, William J. King, John F. Sullivan | 1987-01-06 |
| 4418857 | High melting point process for Au:Sn:80:20 brazing alloy for chip carriers | Norman G. Ainslie, James E. Krzanowski | 1983-12-06 |