SR

Srinivasa S. N. Reddy

IBM: 51 patents #1,671 of 70,183Top 3%
Globalfoundries: 1 patents #2,221 of 4,424Top 55%
S( Standard Oil Company (Indiana): 1 patents #254 of 576Top 45%
📍 Lagrangeville, NY: #13 of 200 inventorsTop 7%
🗺 New York: #1,690 of 115,490 inventorsTop 2%
Overall (All Time): #49,475 of 4,157,543Top 2%
53
Patents All Time

Issued Patents All Time

Showing 1–25 of 53 patents

Patent #TitleCo-InventorsDate
9379007 Electromigration-resistant lead-free solder interconnect structures Charles L. Arvin, KENNETH BIRD, Charles C. Goldsmith, Sung K. Kang, Minhua Lu +4 more 2016-06-28
8910853 Additives for grain fragmentation in Pb-free Sn-based solder Charles L. Arvin, Alexandre Blander, Peter J. Brofman, Donald W. Henderson, Gareth G. Hougham +7 more 2014-12-16
8493746 Additives for grain fragmentation in Pb-free Sn-based solder Charles L. Arvin, Alexandre Blander, Peter J. Brofman, Donald W. Henderson, Gareth G. Hougham +7 more 2013-07-23
7683493 Intermetallic diffusion block device and method of manufacture Charles L. Arvin, Carla A. Bailey, Harry D. Cox, Hua Gan, Hsichang Liu +3 more 2010-03-23
7666780 Alignment verification for C4NP solder transfer Jerry A. Gorrell, Sarah H. Knickerbocker 2010-02-23
7344679 Method and apparatus for point of care osmolarity testing Govindarajan Natarajan, James N. Humenik, Scott Partington 2008-03-18
6974358 Discrete magnets in dielectric forming metal/ceramic laminate and process thereof Govindarajan Natarajan, John U. Knickerbocker, Rao V. Vallabhaneni 2005-12-13
6943108 Interposer capacitor built on silicon wafer and joined to a ceramic substrate Mukta G. Farooq, John U. Knickerbocker, Robert A. Rita 2005-09-13
6900395 Enhanced high-frequency via interconnection for improved reliability Janet L. Jozwiak, Gregory B. Martin, Linda L. Rapp 2005-05-31
6791133 Interposer capacitor built on silicon wafer and joined to a ceramic substrate Mukta G. Farooq, John U. Knickerbocker, Robert A. Rita 2004-09-14
6653776 Discrete magnets in dielectric forming metal/ceramic laminate and process thereof Govindarajan Natarajan, John U. Knickerbocker, Rao V. Vallabhaneni 2003-11-25
6569496 CVD of metals capable of receiving nickel or alloys thereof using inert contact Donald R. Wall, John J. Garant, Kevin M. Prettyman 2003-05-27
6565917 Method of forming features on a ceramic substrate using platible pastes Donald R. Wall 2003-05-20
6494758 Process of forming metal/ferrite laminated magnet Govindarajan Natarajan, John U. Knickerbocker, Rao V. Vallabhaneni 2002-12-17
6489686 Multi-cavity substrate structure for discrete devices Mukta S. Farooq, John U. Knickerbocker 2002-12-03
6413339 Low temperature sintering of ferrite materials Govindarajan Natarajan, Jon A. Casey, Martin Klepeis, John U. Knickerbocker, Robert A. Rita +1 more 2002-07-02
6376054 Surface metallization structure for multiple chip test and burn-in Scott I. Langenthal, Thomas E. Lombardi, Richard F. Indyk, John U. Knickerbocker, Richard A. Shelleman +2 more 2002-04-23
6358439 Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias Farid Youssif Aoude, Lawrence D. David, Renuka S. Divakaruni, Shaji Farooq, Lester W. Herron +6 more 2002-03-19
6339527 Thin film capacitor on ceramic Mukta S. Farooq, John U. Knickerbocker, Robert A. Rita, Roy R. Yu 2002-01-15
6319829 Enhanced interconnection to ceramic substrates Robert W. Pasco, Rao V. Vallabhaneni 2001-11-20
6312791 Multilayer ceramic substrate with anchored pad Benjamin V. Fasano, David H. Gabriels, Richard F. Indyk, Sundar M. Kamath, Scott I. Langenthal +1 more 2001-11-06
6258191 Method and materials for increasing the strength of crystalline ceramic Benjamin V. Fasano, Lewis S. Goldmann, Richard F. Indyk, Sundar M. Kamath, Scott I. Langenthal 2001-07-10
6228682 Multi-cavity substrate structure for discrete devices Mukta S. Farooq, John U. Knickerbocker 2001-05-08
6227943 Method and system for pre-cleaning and post-cleaning deposited metal John J. Garant, Charles H. Perry, Donald R. Wall 2001-05-08
6224682 CVD of metals capable of receiving nickel or alloys thereof using inert contact Donald R. Wall, John J. Garant, Kevin M. Prettyman 2001-05-01